Single-Layer Resin Cover Panel for Display Devices
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Solution Overview
Problem
Existing display devices with multi-layered cover panels are complex and costly to manufacture, and they often suffer from non-uniform flatness and inadequate protection due to the need for multiple adhesive layers and stacked functional layers.
Innovation Solution
A display device with a single-layered cover panel manufactured using a screen-printing process, where inorganic films with different thermal expansion coefficients are deposited on a display panel, and a resin is coated and cured to form a flat, multifunctional cover panel without the need for separate adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layered cover panel structure is used to provide various protection functions, then the protective capabilities are improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple protective functions (impact resistance, heat dissipation, electromagnetic shielding) into a single-layered cover panel structure. The inorganic particles are dispersed throughout the resin matrix to simultaneously provide mechanical strength, thermal management, and electromagnetic interference protection, eliminating the need for separate functional layers and adhesive layers required in multi-layered structures.
Solution Approach 2:
The cover panel uses a composite material system consisting of resin matrix combined with inorganic particles. This composite structure enables the single layer to perform multiple functions: the resin provides bonding and structural integrity while the inorganic particles contribute to impact resistance, heat dissipation, and electromagnetic shielding properties.
2Device complexity
If a single-layered cover panel is used to simplify the structure, then the manufacturing complexity is reduced, but the flatness uniformity deteriorates
Solution Approach 1:
The patent employs temperature parameter changes during the manufacturing process. The resin is coated at a first temperature and then heated to a second temperature (higher than the first) to facilitate particle aggregation and uniform distribution. This temperature-controlled process ensures the inorganic particles aggregate uniformly throughout the resin, achieving flatness uniformity despite the simplified single-layered structure.
3Reliability
If inorganic particles are dispersed in the resin to improve protection, then the protective capabilities are enhanced, but the particle aggregation uniformity worsens
Solution Approach 1:
The patent uses temperature parameter changes to control particle aggregation. The resin is heated to a second temperature (higher than the coating temperature) which facilitates uniform particle aggregation throughout the resin matrix. This thermal energy enables the inorganic particles to distribute uniformly while maintaining their protective functions.
Solution Approach 2:
The manufacturing process involves sequential temperature stages: coating at a first temperature, then heating to a second temperature. This periodic temperature variation allows the resin to first be applied in a controlled manner, then undergo uniform particle aggregation, achieving both good protective capabilities and uniform particle distribution.
4Strength
If multiple adhesive layers are used in a multi-layered cover panel, then the bonding strength is improved, but the manufacturing cost and complexity increase
Solution Approach 1:
The patent eliminates multiple adhesive layers by using a single-layered cover panel where the resin itself serves as the bonding material. The inorganic particles are dispersed within the resin matrix, creating a unified structure that provides bonding strength without requiring separate adhesive layers between multiple panels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the flatness and protective capabilities of the cover panel while simplifying the manufacturing process, enhancing impact resistance, heat dissipation, and electromagnetic shielding without the complexity of stacked layers.
Implementation Method 1
depositing a plurality of inorganic films having different thermal expansion coefficients, respectively, on the display panel
Implementation Method 2
coating the display panel with a resin for a cover panel
Data Source
AI summary
A method for manufacturing a display device includes preparing a display panel, depositing a plurality of inorganic films having different thermal expansion coefficients, respectively, on the display panel, loading the display panel on a stage, heating the stage, coating the display panel with a resin for a cover panel, and cooling the stage.