Resin-Covered Electronic Component Without Screw Fixation
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Solution Overview
Problem
Conventional electronic components with substrates fixed using screws face challenges in miniaturization due to the need for space to accommodate screw fixation, which complicates downsizing and increases the number of components and manufacturing steps.
Innovation Solution
An electronic component design that covers the substrate with a thermoplastic resin having a higher melting point than the solder, allowing the substrate to be integrated without screw fixation, thereby reducing the need for additional space and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is fixed to the housing using screws, then the substrate can be securely fixed and protected, but the electronic component size increases due to the space required for screw fixation
Solution Approach 1:
The invention extracts and eliminates the screw fixation mechanism from the electronic component structure. Instead of using screws to fix the substrate to the housing, the substrate is directly integrated into the housing structure, removing the need for separate fixation elements and reducing overall component volume.
Solution Approach 2:
The substrate and housing are merged into a unified structure where the substrate is directly formed within the housing body. This integration eliminates the boundary between substrate mounting and housing structure, removing the need for separate fixation mechanisms and reducing space requirements.
2Strength
If multiple screws are used to fix the substrate, then the substrate can be securely mounted, but the device complexity increases due to additional components and fixation structures
Solution Approach 1:
The invention extracts and removes the screw fixation system entirely from the device structure. The substrate is directly integrated into the housing without requiring any separate fixation components, thereby reducing device complexity while maintaining structural integrity.
Solution Approach 2:
The substrate mounting function is merged with the housing structure itself. The housing directly provides the mounting function without requiring separate screws or fixation mechanisms, simplifying the overall device structure.
3Reliability
If the substrate is accommodated in a housing with screw fixation, then the substrate is protected from exposure, but the housing size increases due to the space required for screw fixation
Solution Approach 1:
The substrate protection function is merged with the housing structure. The substrate is directly integrated into the housing body, eliminating the need for separate fixation mechanisms and reducing the overall housing volume while maintaining protective enclosure.
4Strength
If screw fixation structures are provided on the substrate, then the substrate can be securely fixed to the housing, but the manufacturing process becomes more complex with additional steps
Solution Approach 1:
The invention extracts and eliminates the screw fixation structures from the substrate design. The substrate is directly integrated into the housing without requiring any fixation structures, simplifying the manufacturing process by reducing the number of components and assembly steps.
Solution Approach 2:
The substrate fixation function is merged with the substrate-housing integration process. The substrate is directly formed within the housing structure in a unified manufacturing process, eliminating the need for separate fixation structure fabrication and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables miniaturization of the electronic component by eliminating the need for screw fixation, reducing the number of components and manufacturing steps, while protecting the substrate without direct contact with the thermoplastic resin.
Implementation Method 1
the covering portion is molded by melting the thermoplastic resin in a state where the solder and the thermoplastic resin are in contact with each other
Implementation Method 2
since the solder is coated, the possibility of conducting heat to the solder from the molten thermoplastic resin and remelting the solder can be reduced
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3C
AI summary
An electronic component (1) includes: a substrate (10) to which a component is bonded by solder (13); a coating (14) that covers the solder (13); and a covering portion (20) that covers the substrate (10) and the coating (14) and is made of a thermoplastic resin having a melting point higher than a melting point of the solder (13).