Component-embedded substrate with resin-covered intermediate wiring

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Solution Overview

Problem

In component-embedded substrates with an intermediate wiring substrate interposed between two wiring substrates, moisture introduction from the interface between the intermediate wiring substrate and encapsulating resin leads to issues like the popcorn phenomenon and metal ion migration, compromising the reliability of the substrate.

Innovation Solution

The substrate design includes an intermediate wiring substrate entirely covered by encapsulating resin, preventing moisture introduction by isolating the interface between the intermediate wiring substrate and the external environment, thereby enhancing the reliability of the component-embedded substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an intermediate wiring substrate is interposed between two wiring substrates to adjust the interval and improve component mounting freedom, then the degree of freedom of component mounting is improved, but moisture is likely to be introduced from the interface between the intermediate wiring substrate and the encapsulating resin, causing reliability issues

Engineering Contradiction:

Improvedegree of freedom of component mountingVSAvoidsubstrate reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The intermediate wiring substrate is completely embedded within the encapsulating resin, with its side surfaces entirely covered. This nesting configuration isolates the substrate interface from the external environment, preventing moisture ingress while preserving the intermediate substrate's function in adjusting interval and enabling component mounting freedom.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The encapsulating resin serves as an intermediary that completely surrounds the intermediate wiring substrate, creating a protective barrier between the substrate interface and the external environment. This mediator prevents moisture from reaching the interface while allowing the intermediate substrate to fulfill its structural and functional roles.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the side surface of the intermediate wiring substrate is exposed from the encapsulating resin, then the manufacturing process is simplified, but moisture introduction causes popcorn phenomenon and metal ion migration

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmoisture introduction

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The encapsulating resin forms a continuous protective shell around the intermediate wiring substrate, completely covering its side surfaces. This resin shell acts as a moisture barrier, preventing harmful factors from reaching the substrate interface while maintaining the structural integrity and functionality of the intermediate substrate.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS11424192B2Component-embedded substrate

Publication Date: 2022.08.23 SHINKO ELECTRIC IND CO LTD

AI summary

A component-embedded substrate includes a first wiring substrate, an electronic component provided on the first wiring substrate, an intermediate wiring substrate provided around the electronic component on the first wiring substrate and connected to the first wiring substrate via a first connection member, a second wiring substrate provided above the first wiring substrate, the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second connection member, and an encapsulating resin filled between the first wiring substrate and the second wiring substrate and covering the electronic component and the intermediate wiring substrate. Side surfaces of the intermediate wiring substrate are entirely covered by the encapsulating resin.