Resin Composition Crack Suppression Adhesion
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Solution Overview
Problem
Existing resin compositions for surface protective films and interlayer insulating films in semiconductor elements face challenges in suppressing crack generation, especially after development, and maintaining adhesiveness under various testing conditions such as pressure cooker tests and high-temperature storage.
Innovation Solution
A resin composition comprising polyimide or polybenzoxazole precursors, specific compounds like N-methyl-2-pyrrolidone, rust inhibitors, and silane coupling agents, which form a film that reduces crack generation and enhances adhesiveness to substrates like Cu and SiN, even after exposure to harsh conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photosensitive resin compositions are used to simplify production processes, then manufacturing efficiency is improved, but crack generation occurs when the resin film is left stationary after development
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin film by incorporating specific additives (rust inhibitors and silane coupling agents) into the photosensitive resin composition. This changes the film's chemical properties to prevent crack generation during storage, resolving the contradiction between manufacturing efficiency and crack resistance
Solution Approach 2:
The patent introduces intermediary substances (rust inhibitors and silane coupling agents) that mediate between the resin film and environmental factors causing cracks. These intermediaries protect the film structure during storage, allowing the simplified photosensitive process to maintain both efficiency and reliability
2Reliability
If conventional resin compositions are used for surface protective films, then basic protection is provided, but adhesiveness deteriorates under harsh testing conditions such as pressure cooker tests and high-temperature storage
Solution Approach 1:
The patent creates a composite resin composition by combining photosensitive resin with rust inhibitors and silane coupling agents. This composite structure provides both basic protection and enhanced adhesiveness under harsh conditions, resolving the contradiction between basic protection and adhesive strength
Solution Approach 2:
The patent applies local quality enhancement by incorporating silane coupling agents that specifically improve interfacial adhesion properties where the resin film contacts the substrate. This localized enhancement maintains basic protection while significantly improving adhesiveness under thermal and humidity stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively suppresses crack formation and maintains excellent adhesiveness to Cu and SiN substrates, as demonstrated by improved performance in pressure cooker tests and high-temperature storage evaluations, ensuring reliable electronic components.
Implementation Method 1
a silane coupling agent... enhances adhesiveness to substrates like Cu and SiN
Implementation Method 2
a rust inhibitor... maintains excellent adhesiveness to Cu and SiN substrates
Implementation Method 3
heat-treating the resin film
Data Source
AI summary
A resin composition comprising the following component (A), the following component (B), and one or more selected from the group consisting of the following component (C) and the following component (D).(A) polyimide, a polyimide precursor, polybenzoxazole, or a polybenzoxazole precursor(B) one or more selected from the group consisting of a compound represented by the following formula (11), a compound represented by the following formula (21), and N-methyl-2-pyrrolidone(C) a rust inhibitor(D) a silane coupling agent