Resin Composition Cross-Linking Agent Fluidity Control
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Solution Overview
Problem
Conventional polyphenylene ether resin compositions using triallyl isocyanurate (TAIC) or triallyl cyanurate (TAC) as cross-linking agents face issues with fluidity, evaporation, and inconsistent physicochemical properties, making them difficult to process and leading to environmental pollution and inconsistent laminate properties.
Innovation Solution
A thermal-curable resin composition using a specific diallyl isocyanurate compound with a modified structure as the cross-linking agent, combined with a polyphenylene ether resin and a catalyst, to enhance processing stability and achieve outstanding peel strength and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If triallyl isocyanurate (TAIC) or triallyl cyanurate (TAC) is used as a cross-linking agent, then thermal resistance and chemical resistance are improved, but fluidity deteriorates causing runback during impregnation
Solution Approach 1:
The patent modifies the molecular structure of the cross-linking agent by introducing a bulky substituent group at the 5-position of the isocyanurate ring. This structural parameter change reduces fluidity and prevents runback while maintaining the cross-linking functionality and thermal resistance properties of the TAIC/TAC compounds.
Solution Approach 2:
The invention creates a composite cross-linking agent that combines the reactive diallyl isocyanurate structure with a bulky substituent group. This composite structure integrates the beneficial cross-linking properties with the steric hindrance needed to control fluidity, achieving both thermal resistance and processability.
2Reliability
If TAIC or TAC monomers are used as cross-linking agents, then cross-linking efficiency is improved, but evaporation occurs causing environmental pollution and inconsistent laminate properties
Solution Approach 1:
The patent changes the volatility parameter of the cross-linking agent by introducing a bulky substituent group with higher boiling point. This reduces evaporation during the impregnation and hot-pressing processes, eliminating environmental pollution and ensuring consistent laminate properties while preserving cross-linking efficiency.
3Strength
If TAIC or TAC is used as cross-linking agent, then peel strength can be achieved, but processing stability deteriorates due to high fluidity
Solution Approach 1:
The patent modifies the viscosity and fluidity parameters of the cross-linking agent through structural modification. The bulky substituent group increases viscosity to prevent runback during processing, improving processing stability while the diallyl isocyanurate structure maintains cross-linking efficiency and peel strength.
4Ease of manufacture
If cross-linking agents with high fluidity are used, then impregnation can proceed, but runback occurs making mass production difficult
Solution Approach 1:
The patent optimizes the viscosity parameter of the cross-linking agent by introducing a bulky substituent group. This creates a balanced fluidity that allows complete impregnation of reinforcing materials while preventing runback, enabling stable mass production and continuous manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a stable, easy-to-process electronic material with consistent physicochemical and dielectric properties, improving peel strength and thermal resistance while reducing volatility and environmental impact.
Implementation Method 1
a cross-linking agent of formula (I)... the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond
Implementation Method 2
a catalyst... wherein the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5
Implementation Method 3
thermal-curable resin composition... The resin composition of the present invention is easy-to-process and stable, and the electronic material prepared from the resin composition
Data Source
AI summary
A resin composition and uses of the same are provided. The resin composition includes the following components:(A) a cross-linking agent of the following formula (I):(B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and(C) a catalyst,wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.


