Thermosetting Resin Void Removal via Curing Degree Curve
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Solution Overview
Problem
During the heating process of thermosetting resin used to seal electronic components on circuit boards, residual voids form, leading to a deterioration in the quality of the resin, making it prone to peeling and other defects.
Innovation Solution
A method is developed to determine curing conditions by creating a curing degree curve that calculates the void removal time based on heating temperature, allowing for precise heating times to minimize residual voids, and includes converting the curve to viscosity to understand the kinetic state of voids, with optional ultrasonic or magnetic field application to ensure void removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If heating is applied to cure the thermosetting resin, then the curing degree increases, but voids are produced and remain inside the resin
Solution Approach 1:
The patent applies preliminary action by heating the resin before complete curing to promote void removal. The heating is performed in a controlled manner during the curing process to allow voids to escape before the resin fully solidifies, preventing void entrapment while achieving proper curing degree.
Solution Approach 2:
The patent employs parameter changes by controlling heating temperature and time parameters to optimize the curing process. By adjusting these parameters, the resin viscosity and curing rate are controlled to facilitate void removal while achieving the desired curing degree without excessive void formation.
2Object-generated harmful factors
If heating time is extended to remove voids, then void removal improves, but production time increases
Solution Approach 1:
The patent optimizes heating parameters (temperature and time) to achieve the minimum effective heating duration for void removal. By carefully controlling these parameters, the process achieves effective void removal without unnecessarily extending production time, balancing quality with efficiency.
Solution Approach 2:
The patent integrates void removal into the continuous curing process rather than treating it as a separate step. The heating action continues throughout the curing process, simultaneously achieving void removal and curing, thereby eliminating idle time and maintaining continuous productive action.
3Productivity
If heating temperature is increased to accelerate curing, then curing speed increases, but void formation increases
Solution Approach 1:
The patent optimizes the heating temperature parameter to achieve an optimal balance between curing speed and void formation. By controlling the temperature within a specific range and duration, the process accelerates curing while minimizing void generation, achieving both high productivity and quality.
Solution Approach 2:
The patent applies partial heating action by using controlled, moderate heating rather than excessive high-temperature heating. This partial action approach achieves sufficient curing speed while avoiding the harmful effects of excessive heat that would generate more voids, maintaining an optimal balance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces residual voids in thermosetting resin, enhancing the quality of the sealing material and improving the reliability of circuit devices by accurately determining the void removal time and optimizing heating processes.
Implementation Method 1
a thermosetting resin is used for sealing a gap between an electronic component and the circuit board
Implementation Method 2
an appropriate pattern of heating would be determined
Implementation Method 3
a void removal time of a void naturally moving upward in the thermosetting resin
Data Source
AI summary
A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.