Resin Layer Cutting via Blast Grooves in Flexible Displays
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Solution Overview
Problem
The process of cutting resin layers in flexible display manufacturing is inefficient, leading to yield degradation due to high viscosity and sublimation issues when using scribe cutters or lasers, which affects the quality and quantity of display devices produced.
Innovation Solution
A method involving the formation of a protective film on a grid-like region surrounding product regions on glass substrates, followed by blast processing to remove resin layers, allowing for precise cutting and peeling of substrates without cracking or reattachment of foreign substances, thereby improving yield and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a scribe cutter is used to cut the resin layer, then the glass substrate can be separated into individual pieces, but the resin layer cannot be effectively cut due to high viscosity and the yield is degraded
Solution Approach 1:
The patent divides the resin layer removal process into two stages: first removing resin in the grid region to create cutting grooves, then removing resin in the product region. This segmentation allows the cutting process to proceed effectively without being hindered by the high viscosity of the intact resin layer.
Solution Approach 2:
The patent performs preliminary removal of the resin layer in the grid region before cutting the glass substrate. This preliminary action creates grooves that facilitate subsequent cutting and prevents the resin from interfering with the cutting process, thereby improving both efficiency and yield.
2Productivity
If a laser is used to cut the resin layer, then the glass substrate can be cut, but sublimate from the resin layer reattaches to the area around the cut part and degrades quality
Solution Approach 1:
The patent extracts and removes the resin layer material from the cutting path before the cutting process. By removing the resin in the grid region first, there is no resin left to sublime and reattach during subsequent cutting operations, thus preventing quality degradation.
Solution Approach 2:
The patent performs preliminary removal of resin through blast processing before laser cutting. This preliminary action eliminates the source of sublimate that would otherwise contaminate the cut area, ensuring high cut quality while maintaining cutting speed.
3Manufacturing precision
If the resin layer is removed by blast processing in the product region, then cutting precision is improved, but the process time increases
Solution Approach 1:
The patent segments the blast processing into two distinct regions: grid region processing for creating cutting grooves, and product region processing for precise cutting. This segmentation allows each region to be optimized for its specific function, improving overall precision without excessive time loss.
Solution Approach 2:
The patent applies blast processing selectively only to the grid region and necessary product region areas, rather than the entire substrate. This partial action achieves the required precision while minimizing the time loss associated with full-area processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the yield and quality of display devices by preventing resin layer degradation during cutting, ensuring accurate separation of substrates and minimizing defects, while maintaining the integrity of the glass substrates and resin layers.
Implementation Method 1
a protective film that is harder than the glass substrate at least in a first grid region that surrounds each of the plurality of product regions and is grid-like
Implementation Method 2
removing a part of the resin layer by blast processing in a second grid region that avoids the plurality of product regions
Implementation Method 3
a sublimate arises from the resin layers due to an irradiation of the laser on the resin layers
Data Source
AI summary
A glass substrate that corresponds to a plurality of product regions and a first grid region that surrounds each of the plurality of product regions and is grid-like is prepared. A protective film that is harder than the glass substrate is formed in the first grid region. A resin layer is formed so as to cover the protective film and the glass substrate. A part of the resin layer is removed by blast processing in a second grid region that avoids the plurality of product regions, overlaps with the first grid region and surrounds each of the plurality of product regions. A circuit layer is formed on the resin layer. The glass substrate is cut along lines that pass through the second grid region where the part of the resin layer is removed. The glass substrate is peeled off from the resin layer.