Resin Electrode Tip Bonding on Ceramic Base Body for Solder Peeling Prevention
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Solution Overview
Problem
Ceramic electronic components face issues with the peeling of overlying electrodes when immersed in high-temperature solder and poor substrate bending resistance due to stress concentration on underlying electrodes, particularly when the overlying electrode does not cover the underlying electrode completely.
Innovation Solution
A chip-type ceramic electronic component with a resin electrode tip portion bonded to the ceramic base body, where the ten-point average surface roughness of the bonded region is higher than the region without the external electrode, ensuring a strong anchor effect and preventing peeling, and a plating film layer is used to improve solderability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the overlying electrode is extended over the circumference of the underlying electrode onto the side face of the ceramic base body, then the stress absorption capability is improved, but the electrode peels from the side face when immersed in high-temperature solder
Solution Approach 1:
The patent applies different surface roughness characteristics to different regions of the ceramic base body. Specifically, the region where the resin electrode tip bonds to the ceramic base body has a higher surface roughness (Rz1 > 3.3 μm) compared to other regions. This local quality differentiation creates a strong anchor effect that prevents peeling while maintaining stress absorption capabilities.
2Device complexity
If the overlying electrode does not cover the underlying electrode completely, then the manufacturing complexity is reduced, but the substrate bending resistance deteriorates due to stress concentration
Solution Approach 1:
The patent changes the physical-chemical parameters of the bonding interface by controlling surface roughness. The bonded region has Rz1 > 3.3 μm while other regions have lower roughness (Rz2). This parameter change in surface topology enhances the anchor effect, allowing the resin electrode to firmly bond to the ceramic base body and distribute stress effectively, thereby improving substrate bending resistance without requiring complete electrode coverage.
3Strength
If the surface roughness of the bonded region is increased, then the anchor effect and bonding strength are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent implements local quality differentiation by creating a specific rough surface region (Rz1 > 3.3 μm) only where the resin electrode tip bonds to the ceramic base body, while maintaining smoother surfaces (Rz2) in other regions. This localized approach concentrates the manufacturing precision requirements to specific areas, making the process more controllable and reproducible compared to requiring uniform high roughness across the entire surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the ceramic electronic component by preventing peeling of the resin electrode tip portion and improving substrate bending resistance, while maintaining high electrical conduction reliability and solderability.
Implementation Method 1
at least a tip portion of the region extended around the different face is bonded to the ceramic base body
Data Source
AI summary
The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2<3.2 μm, wherein Rz1 is a ten-point average surface roughness of a first region of a surface of the ceramic base body to which the tip portion is bonded, and Rz2 is a ten-point average surface roughness of a second region of the surface of the ceramic base body where the external electrode is not formed.