Temporary Protective Resin for Electromagnetic Shielding
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Solution Overview
Problem
Conventional electromagnetic shielding methods require large areas and increased height, hindering the downsizing and thinning of electronic devices, especially in complex electronic components like BGA packages, where forming a shield on desired portions is challenging due to bleeding issues with temporary protective materials.
Innovation Solution
A manufacturing method involving a specific resin composition with controlled elastic modulus, photocuring, and dicing steps to form a metal film electromagnetic shield on electronic components, ensuring embeddability and preventing bleeding, while allowing for efficient dicing and peeling without burrs or voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal plate electromagnetic shield is used to surround a circuit including a noise source, then electromagnetic shielding is achieved, but the mounting area becomes too large and device height increases
Solution Approach 1:
The patent transitions from two-dimensional planar shielding (metal plates surrounding circuits) to three-dimensional localized shielding by forming metal films on specific portions of the substrate in the thickness direction. This allows electromagnetic shielding to be achieved at targeted locations without requiring large lateral areas, thus resolving the contradiction between shielding effectiveness and mounting area.
Solution Approach 2:
Instead of applying uniform electromagnetic shielding across the entire circuit area, the patent forms metal films only on specific portions of the substrate where shielding is needed. This localized approach provides electromagnetic shielding precisely where required while minimizing the overall mounting area occupied by shielding structures.
2Reliability
If a temporary protective material is used during manufacturing, then protection during processing is achieved, but bleeding occurs that prevents precise metal film formation
Solution Approach 1:
The patent modifies the physical and chemical parameters of the temporary protective material, specifically controlling its elastic modulus to be 3 MPa or less at 25°C before light irradiation and 40 MPa or more after irradiation. This parameter control prevents bleeding during the metal film formation process while maintaining protection functionality, thus resolving the contradiction between protection reliability and manufacturing precision.
Solution Approach 2:
The temporary protective material exhibits dynamic mechanical properties that change in response to light irradiation. Before irradiation, the material remains soft (low elastic modulus) to conform to substrate unevenness and prevent bleeding. After irradiation, it hardens (high elastic modulus) to provide structural support. This dynamic behavior allows the material to adapt to different process requirements, resolving the contradiction between protection and precision.
3Manufacturing precision
If the temporary protective material is made soft for embeddability, then bonding to uneven surfaces is improved, but dicing performance deteriorates due to burr generation
Solution Approach 1:
The temporary protective material undergoes periodic transformation of its mechanical properties through light irradiation. In the first stage (before irradiation), the material is soft to enable embeddability. In the second stage (after irradiation), the material becomes hard to enable clean dicing. This periodic change in physical state allows the material to sequentially satisfy contradictory requirements, resolving the contradiction between embeddability and dicing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of a metal film electromagnetic shield on small electronic components with desired placement, addressing the issue of bleeding and embeddability, and improving dicing performance and peelability, thus facilitating the downsizing and thinning of electronic devices.
Implementation Method 1
a photocuring step of curing the temporary protective material by light irradiation
Implementation Method 2
an electromagnetic shield is deposited by sputtering a metal serving as an electromagnetic shield material
Data Source
AI summary
The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm2 or more.