Semiconductor Package Substrate With Resin-Embedded Bonding Pad Protrusion
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Solution Overview
Problem
The existing manufacturing methods for semiconductor package substrates are complex and have low accuracy, leading to defects during wire bonding.
Innovation Solution
A semiconductor package substrate with a base substrate filled with insulating resin, featuring a die pad and a lead with a bonding pad that includes a protrusion surrounded by resin, improving pattern accuracy and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods using copper clad laminate are used, then through-holes can be formed for electrical connection, but the manufacturing process becomes complicated and accuracy decreases
Solution Approach 1:
The invention extracts and removes the through-hole formation process from the conventional copper clad laminate manufacturing method. Instead of forming through-holes and plating them with gold, the patent uses a simplified process where copper foil is directly patterned on the insulating substrate, eliminating the complex through-hole drilling, plating, and filling steps while maintaining electrical connection functionality.
Solution Approach 2:
The invention inverts the conventional approach by reversing the sequence of operations. Rather than first forming through-holes and then creating patterns, the patent first creates the copper patterns on the surface and then forms the insulating resin structure around them. This inversion simplifies the manufacturing process and improves pattern accuracy.
2Reliability
If conventional manufacturing methods are used, then electrical connections can be established, but defects occur during wire bonding due to low pattern accuracy
Solution Approach 1:
The invention performs preliminary actions by pre-forming the insulating resin structure and embedding the copper patterns within it before the wire bonding process. The bonding pads are precisely formed and surrounded by the cured resin, which provides mechanical support and positional stability, thereby preventing defects during subsequent wire bonding operations.
Solution Approach 2:
The insulating resin acts as an intermediary material that surrounds and supports the copper bonding pads. This resin structure provides mechanical stability and precise positioning for the bonding pads, ensuring high pattern accuracy and preventing defects during wire bonding by mediating between the copper patterns and the external environment.
Data Source
AI summary
A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.