Resin-Embedded Component Carrier Without Temporary Support
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Solution Overview
Problem
Conventional methods for manufacturing component carriers, such as printed circuit boards, require a temporary supporting structure that needs to be removed, leading to residue issues and increased manufacturing complexity, which can cause microcracks and alignment problems.
Innovation Solution
A method where a non-removable resin layer is used to close the through holes in the core structure, fixed by lamination, eliminating the need for a temporary supporting structure and reducing misalignment and residue issues, while forming a stable resin shell.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a temporary supporting structure is used to support the core structure during manufacturing, then the core structure can be stabilized during the lamination procedure, but residues remain on contact faces and cleaning processes are required
Solution Approach 1:
The patent eliminates the temporary supporting structure entirely by using the resin layer itself to provide structural support during the lamination procedure. The resin layer is applied to close the through hole and support the core structure, then cured to form a permanent integral part of the component carrier, thereby removing the source of residue contamination.
Solution Approach 2:
The resin layer serves as an intermediary material that performs multiple functions: it closes the through hole, provides mechanical support to the core structure during lamination, and ultimately becomes part of the final product. This intermediary replaces the temporary supporting structure and avoids residue issues.
2Stability of the object's composition
If a temporary supporting structure is used to support the core structure, then the core structure is stabilized during lamination, but the manufacturing process becomes more complex with additional removal steps
Solution Approach 1:
The patent merges the support function with the resin layer application process. The resin layer that closes the through hole also serves as the supporting structure during lamination, eliminating the need for a separate temporary supporting structure and its subsequent removal step, thereby simplifying the manufacturing process.
Solution Approach 2:
The resin layer performs multiple functions: it closes the through hole, provides mechanical support during lamination, and becomes a permanent part of the component carrier. This multi-functional approach eliminates the need for dedicated temporary supporting structures and reduces process complexity.
3Stability of the object's composition
If a temporary supporting structure is used, then the core structure can be held stable, but alignment problems and misregistration occur between layers
Solution Approach 1:
The resin layer is applied to close the through hole and establish the core structure's position before the lamination procedure begins. This preliminary action ensures proper alignment and registration is achieved before subsequent manufacturing steps, preventing misalignment issues.
Solution Approach 2:
The resin layer acts as an intermediary that bonds the core structure to the subsequent layers with precise alignment. By providing a stable, residue-free bonding surface, it ensures accurate registration between layers without the alignment problems caused by temporary supporting structures.
4Object-generated harmful factors
If cleaning processes such as plasma desmear are applied to remove residues, then contact faces are cleaned, but the manufacturing process time increases
Solution Approach 1:
The patent converts the potential harm of residue contamination into a benefit by using the resin layer as the supporting structure from the beginning. This eliminates residue generation at the source, making cleaning processes unnecessary and reducing manufacturing time.
Solution Approach 2:
By eliminating the temporary supporting structure that generates residues, the patent removes the need for cleaning processes entirely. The resin layer provides support without leaving contaminants, thereby extracting the harmful residue-generating step from the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces microcrack risks, and enhances reliability by providing a robust, residue-free component carrier with improved alignment and reduced gas inclusion.
Implementation Method 1
The component is embedded to the core structure by curing the resin layer, wherein the resin layer may thereby form a resin shell
Implementation Method 2
Next, in a lamination step, in which pressure and heat is applied to the component carrier, the component as well as the core structure are covered and enclosed by the resin material
Data Source
AI summary
A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.