Resin-Embedded Semiconductor Wiring for Reliable Substrate Bonding
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Solution Overview
Problem
Conventional NAND flash memory chip stacking methods face challenges in efficient electrical connections and structural integrity due to the use of perpendicular wiring and bonding techniques, which can lead to reliability issues and increased complexity.
Innovation Solution
A semiconductor device design featuring a semiconductor element sealed with an insulating resin, connected to a wiring substrate through conductive bonding agents, with specific dimensions and configurations of wiring and bonding agents to enhance electrical connectivity and structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If perpendicular wiring and bonding techniques are used to connect NAND flash memory chips, then electrical connections can be established, but reliability issues and structural integrity problems occur
Solution Approach 1:
The patent segments the wiring structure into columnar wirings extending from pad holes through the insulating resin layer, with bonding pads positioned at the surface. This segmentation allows separate optimization of vertical electrical pathways and bonding interfaces, improving reliability while simplifying the overall structure compared to complex perpendicular wiring arrangements.
Solution Approach 2:
The patent introduces an insulating resin layer as an intermediary medium that encapsulates the columnar wirings and provides a stable bonding surface. This intermediary structure protects the electrical connections and distributes mechanical stress, enhancing connection reliability without requiring complex perpendicular wiring configurations.
2Strength
If bonding techniques are used to stack NAND flash memory chips, then chips can be connected, but structural integrity and resistance to external stress are compromised
Solution Approach 1:
The patent applies beforehand cushioning by encapsulating the columnar wirings within the insulating resin layer before bonding. This cushioning structure absorbs and distributes external mechanical stress, protecting the bonding interfaces and electrical connections from damage during stacking and operation, thereby improving bonding strength and stress resistance.
Solution Approach 2:
The insulating resin layer acts as a flexible protective shell that encapsulates the rigid columnar wirings and bonding pads. This flexible encapsulation allows the bonding structure to accommodate thermal expansion and mechanical stress without compromising structural integrity, enhancing both bonding strength and stress resistance.
3Manufacturing precision
If conventional bonding methods are used for chip stacking, then manufacturing can proceed, but manufacturing precision and connection robustness are insufficient
Solution Approach 1:
The patent implements preliminary action by forming the columnar wirings and bonding pads within the insulating resin layer before the bonding process. This preliminary structuring establishes precise alignment features that guide the bonding process, improving manufacturing precision without significantly complicating the overall manufacturing workflow.
Solution Approach 2:
The insulating resin layer serves multiple functions: it provides electrical insulation, mechanical support, stress distribution, and alignment reference for bonding. This multi-functionality consolidates several manufacturing requirements into a single structural element, improving bonding alignment precision while maintaining ease of manufacture through a unified approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved electrical connections and structural integrity, enhancing the reliability and efficiency of semiconductor devices by ensuring robust bonding and reduced risk of breakage under stress.
Implementation Method 1
a first conductive bonding agent that electrically connects the first head portion of the first wiring and the pad
Data Source
AI summary
A semiconductor device of an embodiment includes: a first semiconductor element; a first insulating resin that seals the first semiconductor element; a wiring substrate having a pad; a first wiring that extends from the first semiconductor element toward the wiring substrate, and has a first head portion and a first column portion, the first column portion connected to the first semiconductor element and the first head portion exposed on a surface of the first insulating resin; and a first conductive bonding agent that electrically connects the first head portion of the first wiring and the pad. When a surface of the first head portion facing a side of the first insulating resin is defined as a first surface. A surface of the first insulating resin on a side of the wiring substrate is defined as a second surface. A distance from a surface of the wiring substrate on a side of the first insulating resin to the first surface is defined as a first distance, and a distance from a surface of the wiring substrate on the side of the first insulating resin to the second surface is defined as a second distance. The first distance is shorter than the second distance.