Resin Emulsion Impregnation for Electronic Components
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Solution Overview
Problem
Existing methods for producing electronic components with ceramic base bodies, such as inductors and capacitors, face degradation in electrical characteristics due to resin filling, as the resin penetrates into the inner portions of the base body, affecting the inner conductors and degrading the component's performance.
Innovation Solution
A method involving the use of a heterogeneous resin emulsion for impregnation, which fills the outer peripheral pores while preventing resin penetration into the inner portions, thereby maintaining the electrical characteristics and reducing stress from resin curing and shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a homogeneous liquid resin or solvent-diluted resin solution is used for impregnation, then the surfaces and inner portion of the base body can be highly densely filled with resin, but the pores in the inner portion near inner conductors are filled with resin causing degradation of electrical characteristics
Solution Approach 1:
The patent applies local quality by using resin emulsion with specific particle size distribution (0.01-1 μm) that enables selective filling: smaller particles fill outer peripheral pores while larger particles are excluded from inner portion pores near conductors. This creates spatially varying resin distribution where outer regions are densely filled for sealing while inner regions near conductors remain pore-filled with resin to maintain electrical characteristics.
Solution Approach 2:
The patent changes the physical state parameter of the resin from homogeneous liquid to emulsion form with controlled particle size distribution. By controlling the emulsion particle size (0.01-1 μm) and using it in impregnation, the resin can be selectively deposited in outer peripheral pores while excluding inner portion pores, thus resolving the contradiction between filling density and electrical characteristic preservation.
2Manufacturing precision
If homogeneous liquid resin is used for impregnation, then complete pore filling is achieved, but stress from resin curing and shrinkage affects inner conductors degrading electrical characteristics
Solution Approach 1:
The patent applies local quality by creating non-uniform resin distribution through emulsion impregnation. Outer peripheral regions achieve complete pore filling for structural stability, while inner regions near conductors have reduced resin presence to minimize curing and shrinkage stress on conductors. This spatial differentiation resolves the contradiction between filling completeness and stress reduction.
Solution Approach 2:
The patent changes the resin application method from homogeneous liquid to controlled emulsion with specific particle size distribution. This parameter change enables selective deposition where resin fills outer pores completely while being excluded from inner pores near conductors, thus achieving complete filling where needed while minimizing stress on conductors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the degradation of electrical characteristics and ensures reliable performance by sealing the outer peripheral pores with resin, preventing plating solution and moisture ingress, and minimizing resin-induced stress on the inner conductors.
Implementation Method 1
a method involving immersing a porous base body in a liquid-state uncured resin so as to impregnate the pores in the porous base body with the resin
Data Source
AI summary
A method for producing an electronic component includes a step of preparing a porous base body containing a ceramic and including an inner conductor disposed in the body; and a step of impregnating the base body with a resin emulsion.