Resin Encapsulation Molding With Localized Feed for Void-Free Filling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component manufacturing methods face issues of incomplete resin filling and void generation due to insufficient resin around components located at the peripheral portion of the board, leading to defects such as tearing and wrinkling of the release film.
Innovation Solution
A method involving the formation of a resin distribution set with non-uniform resin material distribution, where the resin material accumulates more thickly at predetermined locations, particularly the peripheral portion, followed by compression-molding to ensure complete resin filling and void-free encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If granular resin is leveled to uniform thickness in the plate resin receiving portion, then resin overflow from cavity is prevented, but resin becomes insufficient around peripheral components causing incomplete filling and void generation
Solution Approach 1:
The invention applies non-uniform resin thickness distribution where the resin layer is thicker at the peripheral portions and thinner at the central portion. This local variation in resin quantity ensures sufficient resin supply to peripheral components during compression molding while preventing overflow at the cavity boundaries, thereby resolving the contradiction between preventing resin overflow and ensuring complete resin filling.
2Ease of manufacture
If resin material is positioned with constant thickness inside the raising and lowering member, then positioning is simplified, but resin becomes insufficient near the outer contour of the cavity after member removal
Solution Approach 1:
The invention positions resin material with non-uniform thickness distribution, thicker at peripheral areas and thinner at the center, to ensure adequate resin supply to peripheral components during compression molding. This local variation in resin quantity prevents resin insufficiency near the cavity outer contour while maintaining ease of manufacture through the raising and lowering member mechanism.
3Ease of operation
If resin material is fed uniformly across the resin receiving portion, then feeding process is simplified, but peripheral areas receive insufficient resin leading to void generation
Solution Approach 1:
The invention implements non-uniform resin material distribution where peripheral areas receive thicker resin layers compared to the central portion. This local variation ensures adequate resin supply to peripheral components during compression molding, preventing void generation and improving reliability, while the overall feeding process remains simplified through the raising and lowering member system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures adequate resin distribution, eliminating incomplete resin filling and void generation, thereby preventing defects like tearing and wrinkling, and achieving a void-free resin molded body.
Implementation Method 1
compression-molding the resin material with the object in contact with the resin material located in the cavity to obtain the resin molded body
Data Source
AI summary
An electronic component manufacturing method for obtaining an electronic component in which a resin molded body and an object are integrally formed and the resultant device is provided. The method includes forming a resin distribution set by feeding a resin material in granular, powder, or liquid form onto a release film in a resin receiving portion to create a non-uniform distribution, wherein the resin material is thicker at a predetermined location than at other locations. The resin distribution set including the release film and placing the resin distribution set onto a lower mold such are lifted and placed over a cavity in a lower mold. The release film covers an inner surface of the cavity, positioning the resin material in the cavity. The resin material is compression-molded with the object in contact with the resin material located in the cavity to obtain the device.