Resin-Filled Workpiece Cutting for Particle-Free Chip Surfaces

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Solution Overview

Problem

Existing workpiece cutting methods leave particles on the cut surface of chips, which can adhere to functional elements during conveyance, and require lengthy working times.

Innovation Solution

A method involving pasting an expandable sheet on the workpiece, forming a modified region with laser light, expanding the sheet to create gaps, filling these gaps with resin, and curing the resin using ultraviolet light to remove particles and shorten working time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional workpiece cutting method is used, then cutting can be performed, but particles remain on the cut surface of chips which can adhere to functional elements during conveyance

Engineering Contradiction:
Improvecut surface qualityVSAvoidparticle adhesion
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

An expandable sheet is introduced as an intermediary between the workpiece and the cutting process. The sheet is pasted on the workpiece, expanded during cutting to create gaps, and then used as a support structure during resin filling. This intermediary enables particle removal through resin application while maintaining cut surface quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Particles are extracted from the cut surface by applying resin that adheres to the particles. The resin, applied through gaps created by the expanded sheet, binds to particles on the cut surface and allows their removal together with the sheet, effectively extracting the harmful particles from the chip surfaces.

Inventive Principle:
Principle #2Taking out (Extraction)

2Productivity

If conventional workpiece cutting method is used, then cutting can be performed, but working time is lengthy

Engineering Contradiction:
Improveworking timeVSAvoidtakt time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The expandable sheet is pasted on the workpiece before the cutting process begins. This preliminary action prepares the workpiece for subsequent gap creation and resin filling operations, enabling particle removal to be integrated into the cutting process flow rather than being a separate post-processing step.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Multiple functions are merged into the expandable sheet: it serves as a protective layer during cutting, a gap-creating structure when expanded, and a support substrate for resin application. This merging of functions reduces the number of separate processing steps and shortens overall working time.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If expandable sheet is expanded to create gaps for resin filling, then particles can be removed, but process complexity increases

Engineering Contradiction:
Improveparticle removalVSAvoidprocess steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The expandable sheet undergoes a parameter change from a flat, compact state to an expanded state with created gaps. This parameter change (expansion) is a simple physical transformation that creates the necessary structure for resin filling without requiring complex additional equipment or processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively removes particles from the cut surface by attaching them to the resin, improves wettability with ultraviolet light, and shortens the working time by optimizing resin application and curing processes.

Implementation Method 1

expanding the expandable sheet to divide at least a part of the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips

Methodology Applied
Scientific EffectElastic expansion: Elasticity

Implementation Method 2

irradiating, after the first step, the workpiece with laser light along a line to cut to form a modified region

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 3

irradiating the expandable sheet with the ultraviolet light can improve the wettability of the expandable sheet

Methodology Applied
Scientific EffectUltraviolet irradiation effect on surface wettability:

Implementation Method 4

curing the resin after the fourth step

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS12519018B2Workpiece cutting method and resin applying device
Publication Date: 2026.01.06 KYORITSU KAGAKU SANGYO KK
  • US12519018B2 patent drawing
  • US12519018B2 patent drawing
  • US12519018B2 patent drawing

AI summary

A workpiece cutting method includes: a first step of pasting an expandable sheet on a workpiece; a second step of irradiating, after the first step, the workpiece with laser light to form a modified region and expanding the expandable sheet to divide the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece; a third step of irradiating the expandable sheet with an ultraviolet light after the first step; a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface; a fifth step of curing the resin after the fourth step; and a sixth step of taking out the chips from above the expandable sheet after the fifth step.