Resin Film Positioning in Liquid Ejection Head Supply Ports
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Solution Overview
Problem
Conventional liquid ejection heads face nozzle clogging issues due to direct contact between photosensitive resin films and silicon nitride films during manufacturing, leading to potential damage and ejection failures that affect image quality.
Innovation Solution
A configuration where a resin film is formed to extend inwardly from the supply port opening edge, with its end portion positioned between the supply port and the silicon nitride film, acting as a bonding film and stress reliever to prevent damage and clogging, and using a poly(etheramide) resin film for improved adhesion and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin film is formed to extend inwardly from the supply port opening edge, then the silicon nitride film is protected from vibration damage, but the film structure becomes more complex
Solution Approach 1:
The resin film serves as an intermediary layer between the silicon nitride film and the supply port opening. By extending inwardly from the opening edge, it acts as a buffer that absorbs vibrations during manufacturing, preventing direct transmission of ultrasonic vibrations to the silicon nitride film and preventing chip formation at the remainder portion.
Solution Approach 2:
The resin film is positioned in advance to cover the region where the silicon nitride film remainder portion will be exposed. This beforehand cushioning protects the fragile silicon nitride film from vibration-induced damage during subsequent manufacturing steps, particularly during supply port formation by etching.
2Reliability
If the resin film end portion is positioned between the supply port and the silicon nitride film, then nozzle clogging is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The resin film is formed to extend inwardly from the supply port opening edge before the supply port is fully formed by etching. This preliminary action ensures that the resin film is already in position to protect the silicon nitride film remainder portion from vibration damage during the subsequent etching process, preventing nozzle clogging in advance.
Solution Approach 2:
The resin film acts as a protective intermediary that prevents direct contact and vibration transmission between the photosensitive resin film and silicon nitride film. This intermediary role eliminates the risk of remainder portion chipping that would otherwise cause nozzle clogging, while the manufacturing complexity increase is localized to the film formation step.
3Device complexity
If the photosensitive resin film and silicon nitride film are directly bonded, then the structure is simpler, but vibrations during manufacturing cause damage and clogging
Solution Approach 1:
The resin film extends inwardly from the supply port opening edge to create an intermediary layer between the photosensitive resin film and silicon nitride film. This intermediary structure breaks the direct bonding connection, allowing the resin film to absorb and dissipate ultrasonic vibrations during manufacturing, thereby preventing vibration-induced damage to the silicon nitride film.
Solution Approach 2:
The resin film is positioned in advance to cover the region where direct bonding between the photosensitive resin film and silicon nitride film would occur. This beforehand cushioning protects the silicon nitride film from vibration damage by absorbing ultrasonic vibrations before they can be transmitted to the film remainder portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents damage to the silicon nitride film and resin film, reducing the risk of nozzle clogging and ensuring reliable ink ejection and improved image quality by absorbing manufacturing vibrations and maintaining film adhesion.
Implementation Method 1
absorbing manufacturing vibrations and maintaining film adhesion
Implementation Method 2
using a poly(etheramide) resin film for improved adhesion and durability
Data Source
AI summary
A liquid ejection head includes a substrate having a supply port that is a through-hole for supplying liquid; an energy generating element for generating energy to be used for ejecting the liquid; a first film that covers the energy generating element; a second film formed on the first film; and a flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice. When viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film.