Resin Composition Flame Retardant Thermal Stability

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Solution Overview

Problem

Conventional epoxy resin compositions for printed circuit boards face issues with flame retardance, thermal stability, and adhesion strength due to the use of halogen-containing flame retardants and bismaleimide resins, leading to poor peeling strength and dielectric properties.

Innovation Solution

A resin composition combining epoxy resin, bismaleimide resin, and a specific structure flame retardant, which improves glass transition temperature, thermal expansion, heat resistance, dielectric properties, and adhesion with metal layers, while mitigating the drawbacks of bismaleimide resin addition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If phosphorus-containing flame retardants are added to epoxy resin composition, then flame retardance is improved, but melting point decreases and thermal decomposition temperature decreases

Engineering Contradiction:

Improveflame retardanceVSAvoidthermal decomposition temperature

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent modifies the chemical structure of phosphorus-containing flame retardants by introducing specific substituents (R1-R6 groups including aromatic rings, alkyl chains, and heteroatoms) to alter thermal properties. This structural parameter change enables the flame retardant to maintain high flame retardance while resisting thermal decomposition at elevated temperatures, directly resolving the contradiction between flame safety and thermal stability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite flame retardant system by combining phosphorus-containing compounds with specific molecular structures (formula I) that integrate flame-retarding functionality with thermal stability. This composite approach allows the material to simultaneously achieve UL94 V-0 flame rating and high thermal decomposition temperature, overcoming the limitation of conventional phosphorus flame retardants.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If phosphorus-containing flame retardants are added to epoxy resin composition, then flame retardance is improved, but coefficient of thermal expansion increases

Engineering Contradiction:

Improveflame retardanceVSAvoidcoefficient of thermal expansion

Core Design Contradiction:

Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent modifies the molecular structure of phosphorus-containing flame retardants by introducing rigid aromatic groups and controlled alkyl chains in formula (I), which changes the thermal expansion characteristics. This structural parameter adjustment reduces the coefficient of thermal expansion while preserving flame retardance, resolving the contradiction between fire safety and dimensional stability.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If bismaleimide resin is added to epoxy resin composition, then heat resistance is improved, but adhesion strength between dielectric material and metal foil deteriorates

Engineering Contradiction:

Improveheat resistanceVSAvoidadhesion strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent introduces a specific ratio parameter (0.01-0.50 mass ratio of bismaleimide resin to epoxy resin) and combines it with a specialized phosphorus flame retardant structure (formula I). This parameter optimization changes the chemical composition balance, allowing the system to achieve high heat resistance (Tg > 170°C) while maintaining adhesion strength above 3.0 lbf/in, resolving the contradiction between thermal performance and bonding strength.

Inventive Principle:

Principle #35Parameter changes

4Temperature

If bismaleimide resin is added to epoxy resin composition, then heat resistance is improved, but dielectric properties deteriorate

Engineering Contradiction:

Improveheat resistanceVSAvoiddielectric properties

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent optimizes the compositional parameters by limiting bismaleimide resin content and introducing a specific phosphorus-containing flame retardant with aromatic structure (formula I). This parameter change achieves heat resistance (Tg > 170°C) while maintaining dielectric constant between 3.5-4.5 and dielectric loss factor between 0.006-0.010, resolving the contradiction between thermal and electrical performance.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20240084135A1Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the same

Publication Date: 2024.03.14 TAIWAN UNION TECHNOLOGY CORP

AI summary

A resin composition and uses thereof are provided. The resin composition includes: (A) an epoxy resin; (B) a bismaleimide resin; and (C) a first flame retardant having a structure of formula (I):Wherein Ar is a C3 to C18 heteroaryl or a C6 to C18 aryl; R1 is H or a C1 to C18 alkyl; andR2 and R3 are independently H, a C1 to C18 alkyl, a C3 to C18 heteroaryl, or a C6 to C18 aryl.