Resin-Free Temporary Adhesive for High-Temperature Substrate Processing
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Solution Overview
Problem
Existing temporary substrate adhesives with resins have limited heat resistance and often result in adhesive residue after detachment, leading to processing issues and reduced yield in substrate processing methods.
Innovation Solution
A temporary substrate adhesive comprising a silane coupling agent with specific functional groups and a photobase generator, but without a resin, which provides excellent heat resistance and minimizes adhesive residue through thermal compression bonding and ultraviolet light-induced detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a temporary substrate adhesive with resin is used for bonding, then bonding strength is achieved, but heat resistance is limited and adhesive residue occurs after detachment
Solution Approach 1:
The patent extracts and removes the resin component from the adhesive composition, retaining only the silane coupling agent and photobase generator. This extraction eliminates the source of adhesive residue while maintaining bonding strength through silane-based chemistry and enabling heat resistance above 400°C without the thermal limitations of organic resins
Solution Approach 2:
The patent changes the chemical composition parameters of the adhesive by eliminating resin and specifying precise proportions of silane coupling agent (0.1-10 wt%) and photobase generator (0.01-1 wt%). This parameter change transforms the adhesive from a resin-based system with limited heat resistance to a silane-based system capable of withstanding temperatures above 400°C
2Strength
If a temporary substrate adhesive with resin is used for bonding, then initial adhesion is achieved, but adhesive residue remains after detachment
Solution Approach 1:
The patent extracts and removes the resin component that causes adhesive residue, keeping only the silane coupling agent and photobase generator. The silane-based adhesive forms a cleaner detachment interface without the polymer residue problems inherent in resin-based systems
Solution Approach 2:
The patent changes the chemical composition by eliminating resin and optimizing silane coupling agent content (0.1-10 wt%), which alters the detachment behavior to minimize residue while maintaining adequate adhesion strength during processing
3Ease of manufacture
If conventional adhesive composition is used, then ease of manufacture is maintained, but processing flexibility and yield are reduced due to residue
Solution Approach 1:
The patent extracts the problematic resin component while retaining the essential adhesive functionality through silane coupling agents. This simplification actually easeS manufacture by reducing the number of components and eliminating resin handling requirements, while simultaneously improving yield through residue-free detachment
Solution Approach 2:
The patent enables complete recovery and reuse of substrates by eliminating adhesive residue through the resin-free formulation. Substrates can be detached cleanly and reused without cleaning processes, improving productivity while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive ensures strong bonding with excellent heat resistance and suppresses adhesive residue, enhancing processing flexibility and yield by allowing for residue-free detachment and re-use of substrates.
Implementation Method 1
the photobase generator has a structure illustrated by the following Formula (3), Formula (4), or Formula (5)
Implementation Method 2
The silane coupling agent includes, for example, a silanol group. The silane coupling agent includes, for example, at least one selected from the group consisting of an amino group, an epoxy group, an azido group, and an isocyanate group
Data Source
AI summary
A temporary substrate adhesive according to an embodiment includes a silane coupling agent and a photobase generator, but does not include a resin.