Resin Impregnated Material Adhesion to Copper Foil
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Solution Overview
Problem
Current electronic circuit board materials face challenges in achieving balanced characteristics of high-frequency signal transmission, impact resistance, adhesion to copper foil, and mechanical strength, particularly in high-temperature environments, with existing materials either compromising on dielectric properties or processability.
Innovation Solution
A resin impregnated material combining a bismaleimide compound with a specific structure and a porous fluororesin, where the bismaleimide compound is represented by General Formula (I) and used in conjunction with a radical polymerization initiator, providing excellent adhesion, dielectric properties, and heat resistance, and the porous fluororesin enhances flexibility and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fluororesin is used as a matrix dielectric layer to achieve low dielectric constant, then dielectric properties are improved, but adhesive property between fluororesin and glass cloth layer deteriorates
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance between the fluororesin and glass cloth layer. This coupling agent contains both organofunctional groups that bond with glass and inorganic functional groups that interact with fluororesin, thereby mediating the adhesive interface and resolving the contradiction between maintaining dielectric properties and improving adhesion.
Solution Approach 2:
The patent creates a composite material system consisting of fluororesin, glass cloth, and silane coupling agent. This composite structure combines the low dielectric constant of fluororesin with the mechanical strength and adhesion provided by the glass-fiber-silane network, achieving both improved dielectric properties and sufficient adhesive property.
2Reliability
If a fluororesin is used as a base material to achieve excellent dielectric properties and heat resistance, then reliability is improved, but adhesive property to copper foil deteriorates
Solution Approach 1:
The silane coupling agent serves as a mediator between the fluororesin base material and copper foil. The coupling agent forms a chemical bridge that enhances interfacial adhesion without compromising the bulk properties of the fluororesin, thereby resolving the adhesion problem while maintaining dielectric properties and heat resistance.
Solution Approach 2:
The patent applies local quality modification by concentrating the silane coupling agent at the interface between fluororesin and copper foil. This localized treatment improves adhesion at the critical interface region while leaving the bulk fluororesin material unchanged, preserving its excellent dielectric properties and heat resistance.
3Reliability
If LCP is used as a substrate material to achieve excellent dielectric properties, then transmission characteristics are improved, but processability deteriorates due to requirement of treatment at temperature around 300°C or higher
Solution Approach 1:
The patent changes the processing temperature parameter from the high temperatures (300°C or higher) required by LCP to lower temperatures achievable with the fluororesin-based material. This parameter change maintains excellent dielectric properties while dramatically improving processability and enabling standard electronic circuit board manufacturing processes.
4Reliability
If LCP is used as a substrate material to achieve excellent dielectric properties, then transmission characteristics are improved, but adhesion to copper foil deteriorates
Solution Approach 1:
The silane coupling agent acts as an intermediary that chemically bonds to both the fluororesin substrate and copper foil, creating a strong interfacial connection. This mediator resolves the adhesion problem between fluororesin and copper while preserving the excellent dielectric properties of the fluororesin base material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves superior dielectric properties, high adhesion to copper foil, impact resistance, and repairability, maintaining mechanical strength even at elevated temperatures, making it suitable for high-frequency electronic circuit boards.
Implementation Method 1
a curable resin composition containing a bismaleimide compound (A) represented by General Formula (I) and a radical polymerization initiator (B)
Data Source
AI summary
The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.