Electronic Circuit Insulation via Resin Injection Through PCB Hole
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Solution Overview
Problem
In surface mount devices, the narrow gap between external electrode terminals often prevents sufficient injection of insulating resin, leading to inadequate insulation and increased size due to longer insulation distances, especially when there are differences in potential between terminals.
Innovation Solution
A method where a hole is created in the printed circuit board between the die pad and external electrode terminal, allowing insulating resin to be injected and fill the gap, thereby improving insulation and reducing the insulation distance between the die pad and external electrode terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If insulation distance is shortened to reduce component size, then component size is reduced, but insulation reliability deteriorates
Solution Approach 1:
The patent introduces insulating resin as an intermediary substance between the die pad and external electrode terminal. This resin fills the gap created by the shortened insulation distance, providing reliable electrical insulation while allowing the component dimensions to be reduced. The resin acts as a mediator that enables shortening of the insulation distance without compromising insulation reliability.
Solution Approach 2:
The patent changes the physical state and distribution of the insulation medium from air (natural gap) to injected insulating resin. By controlling the injection process and resin properties, the insulation characteristics are enhanced while maintaining shorter dimensions. This parameter change allows the insulation distance to be shortened while preserving or improving insulation reliability.
2Volume of moving object
If gap between external electrode terminals is narrowed to reduce size, then component size is reduced, but resin injection difficulty increases
Solution Approach 1:
The patent performs preliminary actions by designing the component structure with predetermined gap dimensions and injection access points before the resin injection process. The gap is designed to be narrow for size reduction but with sufficient access for injection, and the injection system is prepared in advance to handle the specific viscosity and flow requirements of the insulating resin.
Solution Approach 2:
The patent modifies parameters such as resin viscosity, injection pressure, and injection temperature to enable successful resin injection into the narrowed gap. By controlling these parameters, the resin can be injected reliably into the small gap space, overcoming the manufacturing difficulty posed by the reduced dimensions.
3Volume of moving object
If insulation distance is shortened, then component size is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process incorporates preliminary design of the injection system and process parameters before production. The injection molds, resin preparation, and process control systems are designed in advance to handle the shortened insulation distance configuration, preventing complexity from arising during actual manufacturing.
Solution Approach 2:
The patent optimizes process parameters such as injection pressure, temperature, and resin viscosity to simplify the manufacturing process despite the shortened insulation distance. By finding the right parameter combinations, the injection process becomes more controllable and less complex, enabling mass production of the compact component design.
Data Source
AI summary
An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.