Integrated Semiconductor Pressure Sensor with Resin-Encased Temperature Detection
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Solution Overview
Problem
Conventional temperature sensor integrated type semiconductor pressure sensor apparatuses face increased manufacturing costs due to the use of highly heat-conductive materials and manual assembly processes, which can lead to deformation of thin lead wires and reduced temperature detection accuracy.
Innovation Solution
A resin-encased temperature sensor integrated type semiconductor pressure sensor apparatus with a pressure guiding path and a temperature sensor module, where the temperature detection device, lead wire, and terminal are integrated with resin, preventing deformation and simplifying assembly, while using a protrusion to secure accurate positioning and protect against contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a highly heat-conductive member is attached to the case to house the temperature detection device, then the temperature response is improved, but the manufacturing cost increases
Solution Approach 1:
The patent merges the temperature sensor module housing with the case by forming an integrated structure where the case itself serves as the housing for the temperature detection device. This eliminates the need for a separate highly heat-conductive member attachment, reducing manufacturing steps and costs while maintaining temperature response performance through direct thermal coupling.
Solution Approach 2:
The case is designed to serve multiple functions: it houses the pressure detection device, provides structural support, and simultaneously serves as the housing for the temperature detection device. This multi-functional design eliminates the need for additional components and reduces overall manufacturing complexity.
2Manufacturing precision
If manual assembly is used to house the temperature detection device accurately, then the positioning precision is improved, but the productivity decreases
Solution Approach 1:
The temperature sensor module is pre-assembled with the lead wire and terminal in a separate operation before being installed in the case. The case includes pre-formed positioning structures such as recesses and protrusions that guide the module into its correct position during assembly, eliminating the need for manual positioning adjustments and enabling automated assembly.
Solution Approach 2:
The patent replaces manual mechanical positioning with automated insertion mechanisms guided by the case's built-in positioning features. The standardized module design with fixed dimensions and positioning protrusions allows for automated handling and placement, substituting manual dexterity with automated mechanical systems.
3Device complexity
If the lead wire is left exposed during assembly, then the assembly process is simplified, but the lead wire is deformed causing positioning deviation
Solution Approach 1:
The lead wire is pre-positioned and fixed to the temperature detection device before the module is installed in the case. The case includes a dedicated recess that receives and secures the lead wire in its correct position, preventing deformation during the assembly process and eliminating the need for complex wire management procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces manufacturing costs, and maintains accurate temperature detection by integrating the lead wire and terminal with resin, ensuring precise positioning and protection from contaminants.
Implementation Method 1
a resin covering the temperature detection device, the lead wire and the terminal. The temperature detection device, the lead wire and the terminal are integrated together by the resin
Implementation Method 2
a protrusion provided such that part of the container protrudes further than the inlet of the pressure guiding path. The temperature detection device is housed within a highly heat-conductive member attached to the tip of the protrusion
Data Source
AI summary
A temperature sensor integrated type semiconductor pressure sensor apparatus includes a temperature detection device, a lead wire covered with a lead wire protection material, and a terminal, which are integrated together by a thermoplastic resin. This can prevent the lead wire from being deformed in the assembly process, thereby simplifying the assembly process. Furthermore, the temperature detection device is exposed from the opening at the tip of the protrusion, which can secure enough temperature response. Furthermore, the temperature detection device, the lead wire and the lead wire protection material are covered with the thermoplastic resin, so they are protected from combustion gas component, oil contaminant and corrosion product included in intake air.