Resin Interface Temperature Control for Uniform Photocuring
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Solution Overview
Problem
Additive manufacturing processes face challenges in regulating temperature at the resin interface, leading to inconsistent resin viscosity, crosslinking density, and dimensional accuracy due to temperature gradients and excess heat exposure.
Innovation Solution
A method and system for additive manufacturing that involves heating the resin reservoir and gaseous environment to target temperatures, using thermal image sensors and infrared light projections to maintain uniform interface temperatures, thereby controlling resin viscosity and crosslinking density, and reducing temperature gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the resin reservoir is heated to increase resin temperature, then resin viscosity decreases and flow improves, but temperature gradients at the resin interface become more severe leading to inconsistent crosslinking density
Solution Approach 1:
The patent applies local quality by using a transparent heating element integrated into the build window that selectively heats only the resin interface region where photocuring occurs. This localized heating approach maintains uniform temperature at the critical resin interface without creating temperature gradients in the bulk resin, thereby achieving consistent crosslinking density while improving resin flow at the interface.
2Productivity
If heating is applied to maintain resin temperature, then photocuring rate increases, but excess heat exposure causes resin degradation and dimensional inaccuracies
Solution Approach 1:
The patent implements continuous heating through the transparent heating element that maintains the resin interface at the optimal curing temperature throughout the entire photocuring process. This continuous temperature maintenance ensures consistent photocuring rates and crosslinking density without thermal shocks or temperature fluctuations that would cause resin degradation or dimensional inaccuracies.
Solution Approach 2:
The system incorporates temperature sensors that continuously monitor the resin interface temperature and provide feedback to the heating element controller. This closed-loop feedback control adjusts the heating power in real-time to maintain the resin interface at the precise target temperature, preventing both insufficient curing and excessive heat exposure that would degrade resin quality.
3Productivity
If rapid manufacturing is pursued with faster layer deposition, then productivity increases, but temperature regulation at the resin interface becomes inconsistent affecting build quality
Solution Approach 1:
The patent applies preliminary action by pre-heating the resin interface to the target temperature before each layer deposition and photocuring cycle. The transparent heating element continuously maintains the resin interface at the optimal temperature in advance, ensuring that when resin is deposited and cured, the temperature is already optimized for consistent crosslinking density and rapid curing, enabling faster manufacturing without sacrificing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the green strength of the build, increases photocuring rate, and improves dimensional accuracy by maintaining consistent resin properties and reducing internal stresses, allowing for the use of high-viscosity resins and faster manufacturing times.
Implementation Method 1
heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state
Implementation Method 2
calculating an infrared light projection predicted to heat the interface layer to a uniform temperature proximal a target reaction temperature across the resin interface
Implementation Method 3
detecting a temperature distribution across an interface layer of the resin reservoir via a thermal image sensor arranged below the build window
Implementation Method 4
at the resin interface, selectively photocuring a first volume of the resin reservoir to form a first layer of a build adhered to a build platform
Data Source
AI summary
A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.