Resin Laminate Dielectric Layers for Capacitance and PCB Adhesion
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Solution Overview
Problem
Existing resin compositions for capacitor dielectric layers face challenges in achieving both high capacitance and circuit adhesion, while ensuring voltage endurance and interlayer insulation reliability, as increased dielectric filler content often compromises adhesion and reliability.
Innovation Solution
A resin laminate comprising a first layer with a specific epoxy resin, diamine compound, polyimide resin, and dielectric filler, and a second layer with epoxy resin and diamine compound but without polyimide resin, optimized to enhance circuit adhesion and dielectric properties respectively, allowing for improved capacitance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dielectric filler content is increased to improve capacitance, then the dielectric properties are enhanced, but the circuit adhesion and interlayer insulation reliability deteriorate
Solution Approach 1:
The resin composition is segmented into multiple functional components: epoxy resin for adhesion, polyimide resin for heat resistance and adhesion, diamine compound for crosslinking, and dielectric filler for capacitance. This segmentation allows each component to contribute specifically to different properties, resolving the contradiction between high filler content and adhesion reliability.
Solution Approach 2:
The invention uses a composite material system combining epoxy resin, polyimide resin, diamine compound, and dielectric filler in specific proportions. This composite approach enables the material to simultaneously achieve high capacitance (60-85 parts dielectric filler per 100 parts resin composition) and maintain excellent circuit adhesion and interlayer insulation reliability through the synergistic effects of different materials.
2Reliability
If the polyimide resin content is increased to improve heat resistance and adhesion, then the circuit adhesion is enhanced, but the dielectric constant decreases
Solution Approach 1:
The invention optimizes the polyimide resin content within a specific range (5-30 parts per 100 parts resin composition) to balance adhesion and dielectric properties. By precisely controlling this parameter, the composition achieves both excellent circuit adhesion and high dielectric constant, resolving the contradiction between these two properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin laminate achieves enhanced circuit adhesion, voltage endurance, and interlayer insulation reliability while maintaining high capacitance, by balancing the composition and thickness of the two layers to address the trade-off between dielectric properties and adhesion.
Implementation Method 1
a resin component which comprises an epoxy resin and a diamine compound
Implementation Method 2
a dielectric filler being a complex metal oxide comprising at least two selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi
Data Source
AI summary
There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.