Photosensitive Resin Laminate Pre-Wetting for Stepped Substrates
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Solution Overview
Problem
The spin-coating method for forming a flat photosensitive resin layer on semiconductor substrates with stepped surfaces faces challenges due to material loss and difficulty in filling recessed portions, especially when using resin materials for insulation layers in 3D semiconductor packaging.
Innovation Solution
A laminate comprising a semiconductor substrate with a stepped surface, where a photosensitive resin layer is formed using a pre-wetting solvent to fill recessed portions on the substrate, utilizing a photosensitive composition with a silicone or acrylic resin, and a method involving pre-wetting, scraping excess solvent, and subsequent spin-coating to minimize material loss and achieve a flat layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spin-coating method is used to form photosensitive resin layer on stepped substrate, then flat coating film can be formed, but material loss increases and recessed portions cannot be fully filled
Solution Approach 1:
The patent applies preliminary action by first filling the recessed portions of the stepped substrate with a pre-wetting solvent before applying the photosensitive resin composition. This pre-wetting step ensures that the recessed areas are prepared in advance to receive and retain the photosensitive resin material, preventing material loss and ensuring complete filling during the subsequent spin-coating process.
Solution Approach 2:
The pre-wetting solvent acts as an intermediary substance between the stepped substrate and the photosensitive resin composition. It facilitates the uniform distribution and complete filling of the photosensitive resin in the recessed portions, enabling the spin-coating method to effectively form a flat layer while minimizing material loss.
2Ease of manufacture
If spin-coating is applied on stepped surface, then coating can be performed, but recessed portions are not fully filled with photosensitive resin
Solution Approach 1:
The pre-wetting solvent is applied in advance to the stepped substrate before the photosensitive resin composition. This preliminary action ensures that the recessed portions are pre-filled and prepared to receive the photosensitive resin, enabling complete filling while maintaining the simplicity and applicability of the spin-coating method.
Solution Approach 2:
The patent utilizes the fluid dynamics of the pre-wetting solvent and photosensitive resin composition during spin-coating. The centrifugal force generated by rotation distributes the pre-wetting solvent and subsequent resin composition uniformly, ensuring that recessed portions are completely filled while maintaining ease of manufacture through a straightforward liquid coating process.
3Device complexity
If conventional spin-coating is used, then coating process is simple, but material loss is significant and filling rate is low
Solution Approach 1:
The pre-wetting solvent application is a simple preliminary step that significantly reduces material loss of the photosensitive resin during spin-coating. This additional step maintains process simplicity while dramatically improving material utilization efficiency by ensuring recessed portions are pre-filled and ready to retain the resin material.
4Productivity
If photosensitive resin is applied directly on stepped substrate, then process steps are reduced, but flat film formation is difficult and filling is incomplete
Solution Approach 1:
The pre-wetting solvent step is a simple, efficient preliminary action that enables complete filling of recessed portions and formation of a flat photosensitive resin layer. This single additional step significantly improves manufacturing precision while maintaining high productivity by avoiding the need for multiple complex coating or filling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively fills recessed portions on semiconductor substrates with high filling rate and forms a flat photosensitive resin layer, reducing material loss and ensuring even coverage, which is essential for insulation layers in 3D semiconductor packaging.
Implementation Method 1
a recessed portion formed by the stepped surface is filled with a pre-wetting solvent
Implementation Method 2
A spin-coating method uses rotational centrifugal force, and can form a flat coating film by spinning after dropping a coating material onto the center of a wafer
Data Source
AI summary
A laminate includes a semiconductor substrate and a photosensitive resin layer formed on the semiconductor substrate. The photosensitive resin layer contains resin having a silicone skeleton or acrylic resin. The semiconductor substrate has a stepped surface on one side. A recessed portion formed by the stepped surface is filled with a pre-wetting solvent, and the photosensitive resin layer is formed thereon. The recessed portion formed by the stepped surface on the stepped substrate is filled fully with the photosensitive composition containing the resin having silicone skeleton or the acrylic resin, and the laminate can provide the flat photosensitive resin film. Further, there is a method for manufacturing the laminate with less material loss and a patterning method using the laminate.