Photosensitive Resin Lamination for Stable Liquid Discharge Nozzles
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Solution Overview
Problem
The existing method for producing liquid discharge heads results in miscibilization and diffusion of photosensitive resin layers, leading to sensitivity distribution issues and nozzle section inclinations, affecting discharge precision.
Innovation Solution
A method involving the use of photosensitive resin compositions with specific molecular weight, softening point, and epoxy equivalent weight, where the photoexposure dose for the second composition is lower than the first, preventing diffusion and ensuring a stable nozzle shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heating processes are applied during lamination and post-exposure treatment, then the photosensitive resin layers are properly bonded and cured, but miscibilization and diffusion occur between the layers causing sensitivity distribution issues and nozzle inclination
Solution Approach 1:
The patent applies parameter changes by carefully controlling the heating temperature and exposure conditions during lamination and post-exposure treatment. By optimizing these parameters, the patent achieves proper bonding and curing of the photosensitive resin layers while preventing miscibilization and diffusion that would cause sensitivity distribution issues and nozzle inclination.
2Adaptability or versatility
If higher-sensitivity photosensitive resin layer is laminated onto lower-sensitivity layer, then the discharge orifice can be formed with appropriate sensitivity, but diffusion of lower-sensitivity resin into higher-sensitivity resin creates sensitivity distribution gradient
Solution Approach 1:
The patent applies local quality by creating distinct regions within the photosensitive resin layer with different sensitivities. The higher-sensitivity region is localized to specific areas where discharge orifices need to be formed, while the lower-sensitivity regions maintain composition uniformity. This spatial differentiation of sensitivity allows the patent to achieve both the required sensitivity range and composition stability.
3Manufacturing precision
If photoexposure and development steps are executed after lamination, then the discharge orifice pattern is formed, but the higher-sensitivity region assumes a more projected-out shape causing inclination in the nozzle section
Solution Approach 1:
The patent applies preliminary action by performing support measures before the photoexposure and development steps that would cause the higher-sensitivity region to assume a projected-out shape. This may include providing structural support during exposure or controlling the development conditions to prevent excessive etching in the higher-sensitivity region, thereby maintaining the nozzle section shape while still forming the discharge orifice pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a stable nozzle section shape, enhancing discharge precision by controlling miscibilization and diffusion between laminated resin layers.
Implementation Method 1
a step of subjecting the laminated material to photoexposure to obtain a photocured material
Implementation Method 2
a step of heating the developed material to obtain the laminate
Data Source
AI summary
A method for producing a laminate of a cured material from a photosensitive resin composition (1) and a photosensitive resin composition (2), wherein the method includes a step of obtaining a laminated material by laminating the composition (2) onto the composition (1); a step of subjecting the laminated material to photoexposure to obtain a photocured material; a step of developing the photocured material to obtain a developed material; and a step of heating the developed material to obtain a laminate, wherein the photoexposure dose required to cure the composition (2) is smaller than the dose required to cure the composition (1), and wherein the composition (1) contains an epoxy resin (1) having a weight-average molecular weight Mw of 5,000 to 600,000, a softening point of at least 140° C., and an epoxy equivalent weight of not more than 2,300.