Resin Layer Deformation Prevention in Substrate Through Hole Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The deformation of a resin layer on a substrate with a through hole occurs due to pressure differences when the hole is closed, leading to structural issues during the manufacturing process of semiconductor or liquid ejection head substrates.
Innovation Solution
A method involving a support substrate on the back surface of the substrate, bonded with a dry film containing a support member and a resin layer, which maintains the through hole as a closed space while allowing the resin layer to be protected from deformation by controlling temperature and pressure differences, and subsequently separating the support member to open the hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the through hole is closed by bonding a dry film to the front surface of the substrate, then the resin layer can be provided to close the through hole, but pressure differences cause deformation of the resin layer
Solution Approach 1:
The support substrate is bonded to the back surface of the substrate before the dry film is bonded to the front surface. This preliminary action creates a sealed structure that maintains atmospheric pressure inside the through hole during the bonding process, preventing pressure difference deformation of the resin layer.
Solution Approach 2:
The support substrate acts as an intermediary element that seals the back surface of the substrate. This intermediary structure prevents direct exposure of the through hole to atmospheric pressure changes, thereby protecting the resin layer from deformation caused by pressure differences.
2Reliability
If the support substrate is used to maintain structural integrity during bonding, then the resin layer remains undeformed, but an additional separation step is required
Solution Approach 1:
The support substrate is temporarily used during the bonding process to maintain structural integrity, then discarded (separated and removed) after it has served its purpose. This allows the support substrate to be recovered for potential reuse in subsequent batches, minimizing waste and cost.
3Ease of manufacture
If the through hole is kept open during bonding, then the bonding process is simpler, but the resin layer deforms due to pressure differences
Solution Approach 1:
The support substrate is bonded to the back surface before the dry film bonding process. This preliminary sealing action maintains atmospheric pressure inside the through hole during subsequent bonding operations, preventing resin layer deformation without significantly complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deformation of the resin layer by managing pressure and temperature differences, ensuring the integrity of the substrate structure during manufacturing, and allowing for the reuse of the support substrate.
Implementation Method 1
maintains the through hole as a closed space while allowing the resin layer to be protected from deformation by controlling temperature and pressure differences
Implementation Method 2
bonding a dry film to a front surface of the substrate
Data Source
AI summary
A method of manufacturing a structure that includes a substrate provided with a through hole, and a resin layer provided on a front surface of the substrate to close the through hole, includes, in order, preparing the substrate including the through hole and including a support substrate on a back surface of the substrate to close the through hole, bonding a dry film to a front surface of the substrate, the dry film including a support member and a resin layer on the support member, to close the through hole with the resin layer and turn the through hole into a closed space with the substrate, the support substrate, and the dry film, opening the through hole turned into the closed space from the support substrate side, and separating the support member from the dry film while retaining the resin layer on the front surface of the substrate.