Stacked Element Resin Layer with Flattened Fillers for Compact Gaps
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Solution Overview
Problem
Existing technologies face challenges in minimizing the size of assemblies filled with filler-containing resin while controlling costs, as small gaps require expensive fillers and large gaps compromise package compactness.
Innovation Solution
A configuration where the average flattening ratio of fillers in contact with a surface is higher than those not in contact, achieved by grinding the resin layer to ensure fillers with larger diameters fit within the gap, allowing the use of less costly fillers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If small diameter fillers are used to fill small gaps between electric components, then the gap can be properly filled and package size can be minimized, but the cost of fillers increases significantly
Solution Approach 1:
The patent applies local quality by using fillers with different diameters in different regions of the resin layer. Specifically, fillers with larger diameters are used in the lower portion of the resin layer (away from the gap), while fillers with smaller diameters are used in the upper portion (near the gap). This spatial differentiation allows the gap to be properly filled with small fillers while using larger, less expensive fillers in other areas, thereby reducing overall filler cost while maintaining compact package size.
2Ease of manufacture
If large diameter fillers are used to reduce filler cost, then the cost of fillers decreases, but the gap between electric components cannot be properly filled and package size increases
Solution Approach 1:
The patent resolves this contradiction by implementing local quality through spatial differentiation of filler sizes. Large diameter fillers are placed in the lower portion of the resin layer where they can reduce cost, while small diameter fillers are positioned in the upper portion near the gap to ensure proper filling. This localized approach allows each region to have the filler size appropriate for its specific function.
Solution Approach 2:
The patent applies dimensionality change by transitioning from a uniform filler size approach (one-dimensional) to a gradient filler size distribution (three-dimensional). The filler diameter varies continuously or discontinuously through the thickness of the resin layer, creating a dimensional gradient that optimizes both cost and packaging efficiency simultaneously.
3Manufacturing precision
If uniform small diameter fillers are used throughout the resin layer, then the gap can be filled, but the overall filler cost increases and manufacturing efficiency decreases
Solution Approach 1:
The patent applies local quality by differentiating filler size based on location within the resin layer. Small diameter fillers are concentrated in the upper region where gap filling precision is critical, while larger fillers are used in the lower region where precision requirements are less stringent. This localized differentiation maintains manufacturing precision where needed while improving overall productivity and reducing costs.
Solution Approach 2:
The patent applies partial action by using small diameter fillers only in the portion of the resin layer that is critical for gap filling, rather than throughout the entire layer. This partial application of the small filler strategy achieves the necessary precision for gap filling while avoiding the excessive cost and reduced efficiency that would result from using small fillers uniformly throughout the entire resin layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs and maintains assembly size by using larger diameter fillers, enhancing thermal conductivity and reducing surface unevenness, thus improving heat dissipation and manufacturing efficiency.
Implementation Method 1
a grinding step to grind an upper surface of the resin layer
Implementation Method 2
resin has a high coefficient of thermal expansion when it cures, and the resin that has cured causes large stress... Due to a low coefficient of thermal expansion of fillers, as compared to resin, the coefficient of thermal expansion of a filler containing resin is lower
Data Source
AI summary
In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.