Resin Layer Solubility Control for Fine Resist Patterns
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Solution Overview
Problem
Current pattern-forming methods for semiconductor and liquid crystal devices face challenges in achieving fine and favorable resist patterns due to limitations in refining techniques, particularly in increasing pattern thickness and solubility alterations without molecular weight increase.
Innovation Solution
A pattern-forming method involving the application of a resin layer on prepatterns using a composition with a polymer whose solubility is decreased by an acid, accompanied by a basic compound, allowing for insolubilization or desolubilization without molecular weight increase, and subsequent removal of non-adjacent regions with an organic solvent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a crosslinking layer-forming material is applied to increase pattern thickness, then the pattern thickness is increased, but the molecular weight increases which affects solubility control
Solution Approach 1:
The patent changes the solubility parameter of the resin layer by applying a basic compound that converts carboxylic acid groups to carboxylate anions, altering the chemical state rather than simply increasing molecular weight. This allows thickness increase while maintaining solubility control through chemical state transformation.
Solution Approach 2:
The basic compound acts as an intermediary substance that mediates between the resin layer and the desired solubility characteristics. It temporarily modifies the resin layer's chemical properties during processing, enabling thickness increase without permanent molecular weight increase that would compromise solubility.
2Volume of moving object
If a coating-forming agent is applied to increase pattern thickness without molecular weight increase, then the thickness is increased, but the solubility control becomes difficult
Solution Approach 1:
The patent precisely controls solubility by changing the chemical parameter of the resin layer through basic compound application. The conversion of carboxylic acid to carboxylate provides predictable and controllable solubility changes, enabling both thickness increase and precise solubility control.
Solution Approach 2:
The basic compound is applied in advance to modify the resin layer's solubility characteristics before the final development step. This preliminary chemical modification ensures that the resin layer will have the desired solubility properties when needed, allowing precise manufacturing control.
3Manufacturing precision
If a composition with polymer solubility decrease by acid action is used, then fine pattern formation is enabled, but additional processing steps are required
Solution Approach 1:
The patent combines the resin layer formation and solubility modification into a single integrated process step. The basic compound is applied simultaneously with or immediately after the resin layer deposition, merging two functions into one operation and reducing overall process complexity while maintaining fine pattern formation capability.
Solution Approach 2:
The resin layer itself provides the solubility control function through its interaction with the basic compound. The carboxylic acid groups in the resin layer self-react with the basic compound to generate solubility changes, eliminating the need for separate solubility modification steps and simplifying the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of refined, fine, and favorable resist patterns irrespective of pattern type, suitable for future miniaturization in semiconductor processing, through convenient processing steps.
Implementation Method 1
a polymer having a solubility in an organic solvent to be decreased by an action of an acid
Implementation Method 2
by heating the prepattern and the resin layer
Implementation Method 3
The first composition further comprises a basic compound
Data Source
AI summary
A pattern-forming method comprises forming a prepattern that is insoluble or hardly soluble in an organic solvent. A first composition is applied on at least lateral faces of the prepattern to form a resin layer. Adjacent regions to the prepattern of the resin layer are insolubilized or desolubilized in the organic solvent without being accompanied by an increase in a molecular weight by heating the prepattern and the resin layer. Regions other than the adjacent regions insolubilized or desolubilized of the resin layer are removed with the organic solvent. The first composition comprises a first polymer having a solubility in the organic solvent to be decreased by an action of an acid. At least one selected from the following features (i) and (ii) is satisfied: (i) the first polymer comprises a basic group; and (ii) the first composition further comprises a basic compound.