Resin Lens Array Bonding to Substrate
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Solution Overview
Problem
Existing methods for manufacturing devices with high dimensional accuracy and low linear expansion are costly, difficult to produce with high function and productivity, and face challenges in suppressing linear expansion due to environmental temperature influences.
Innovation Solution
A method involving surface activation and bonding of a resin material with a substrate using a silane coupling agent, where the resin material is pressurized at a temperature between the load deflection temperature and glass transition temperature to achieve strong bonding without the need for expensive surface finishing or hydrogen bonding alone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mirror finishing is performed on the surface activated by plasma polymerization, then bonding accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The invention extracts and eliminates the unnecessary mirror finishing step from the conventional bonding process. By using plasma treatment to activate surface groups and employing a multi-stage pressing process, the patent achieves high bonding accuracy without the costly mirror finishing operation, thereby removing this redundant process step.
Solution Approach 2:
The invention changes the bonding parameters by controlling pressing temperature and pressure in multiple stages. The first pressing is performed at a lower temperature to initiate bonding through activated surface groups, followed by a second pressing at higher temperature to complete the bonding, eliminating the need for mirror finishing while maintaining high bonding accuracy.
2Manufacturing precision
If the thickness of the plasma polymerization film is increased to about 10 nm to 10 μm, then close contact between members is improved, but the ability to suppress linear expansion deteriorates
Solution Approach 1:
The invention extracts and eliminates the plasma polymerization film formation step from the conventional process. Instead of relying on a thick plasma polymerization film to achieve close contact, the patent uses direct plasma treatment of the member surfaces to create activated surface groups that enable bonding without requiring an intermediate film layer, thus maintaining linear expansion suppression.
Solution Approach 2:
The invention employs a composite bonding approach by combining plasma-activated surface groups with a multi-stage pressing process. This creates a bonded structure where the interface between members is directly bonded through activated surface groups rather than through a plasma polymerization film, achieving both close contact and linear expansion suppression.
3Device complexity
If hydrogen bonding alone is used to bond members, then bonding simplicity is improved, but bonding strength deteriorates due to moisture
Solution Approach 1:
The invention performs preliminary plasma treatment to activate surface groups on the member surfaces before bonding. This preliminary activation creates reactive groups that form strong bonds during the pressing process, preventing moisture from weakening the bond and eliminating the need for complex protective measures while maintaining bonding strength.
Solution Approach 2:
The invention changes the bonding mechanism from relying solely on hydrogen bonding to using plasma-activated surface group bonding combined with controlled pressing. By controlling the pressing temperature and pressure parameters, the patent achieves strong, moisture-resistant bonding while keeping the process relatively simple.
4Device complexity
If surface activation is performed without controlled pressurization, then process simplicity is improved, but bonding reliability deteriorates due to positional deviation
Solution Approach 1:
The invention performs preliminary plasma treatment to activate surface groups before pressing, which creates strong bonding forces that maintain positional alignment during the pressing process. This preliminary activation ensures reliable bonding without requiring complex positioning mechanisms, maintaining process simplicity while improving bonding reliability.
Solution Approach 2:
The invention changes the pressing parameters by implementing a multi-stage pressing process with controlled temperature and pressure. The first pressing at lower temperature initiates bonding through activated surface groups, maintaining positional alignment, while the second pressing at higher temperature completes the bonding, achieving reliable results without complex positioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of structures with low cost, high function, and high productivity while effectively suppressing linear expansion, maintaining surface activation state for strong bonding and preventing positional deviations during the bonding process.
Implementation Method 1
performing an activation treatment to cause an activation state of at least one of a surface of the first member or a surface of the second member
Implementation Method 2
pressurizing the second member at a temperature that is equal to or higher than a reference temperature obtained by subtracting 30° C. from a load deflection temperature of a resin material of the second member, and is equal to or lower than a glass transition temperature
Implementation Method 3
performing hydrogen bonding of the surfaces of the objects to be bonded
Data Source
AI summary
A method is for manufacturing a structure obtained by stacking a substrate that is a first member as a base material, and lens arrays that are second members that are opposed to the substrate, are formed of a resin material different from the substrate, and have a shape on a surface. The method includes a surface activation step of performing an activation treatment to cause an activation state of at least one of a surface of the substrate or a surface of the lens arrays, and a bonding step of pressurizing the lens arrays at least at a temperature that is equal to or higher than a reference temperature obtained by subtracting 30° C. from a load deflection temperature of a resin material of the lens arrays, and is equal to or lower than a glass transition temperature, to closely bond to the substrate.