Resin Lens Recess Corrects LED Encapsulant Offset

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Solution Overview

Problem

The existing LED device production method results in positional offset of the transparent resin encapsulating body with respect to the LED element, leading to variations in light distribution, which are not sufficient for applications requiring high accuracy.

Innovation Solution

A lens-equipped optical semiconductor device is designed with a resin lens having a recessed portion that houses the transparent resin encapsulating body, and a transparent resin layer is formed to correct the positional offset, ensuring the recessed portion's capacity is at least 1.1 times the total volume of the optical semiconductor element and the encapsulating body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If overmolding is used to produce LED devices with hemispherical transparent resin encapsulating bodies, then productivity is improved through mass production, but manufacturing precision deteriorates due to positional offset of the encapsulating body

Engineering Contradiction:

Improvemass production capabilityVSAvoidpositioning accuracy of encapsulating body

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The invention divides the production process into two independent stages: first, mass production of LED devices with transparent resin encapsulating bodies using overmolding; second, separate mass production of resin lenses with recessed portions. This segmentation allows each stage to be optimized independently - the first for productivity and the second for precision, thereby resolving the contradiction between mass production capability and positioning accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin lens with the recessed portion serves as an intermediary component that corrects the positional offset of the transparent resin encapsulating body. The recessed portion is designed to accommodate the encapsulating body, and the resin lens is positioned relative to the LED element rather than the encapsulating body, thereby mediating the positioning error and achieving accurate light distribution.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the transparent resin encapsulating body is molded to cover the LED element, then the LED element is protected and light extraction is improved, but positional offset occurs relative to the LED element center

Engineering Contradiction:

Improveprotection and light extractionVSAvoidalignment accuracy with LED element

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

Instead of attempting to position the transparent resin encapsulating body precisely relative to the LED element center during overmolding, the invention inverts the approach by positioning the resin lens relative to the LED element and using the recessed portion to accommodate the encapsulating body. This inversion transforms the positioning reference from the encapsulating body to the resin lens, thereby eliminating the offset problem while maintaining protection and light extraction functions.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention changes the design parameter of the recessed portion capacity to be at least 1.1 times the total volume of the LED element and transparent resin encapsulating body. This parameter change provides sufficient space for the encapsulating body within the recessed portion, accommodating positional variations and ensuring proper alignment through the resin lens without requiring precise positioning during overmolding.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If the recessed portion capacity is increased to at least 1.1 times the total volume of the LED element and encapsulating body, then positioning accuracy is improved, but device complexity increases

Engineering Contradiction:

Improvelight distribution accuracyVSAvoidstructural complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The resin lens with the recessed portion serves multiple functions: it corrects positional offset, positions the transparent resin encapsulating body, and maintains the structural integrity of the LED device. The increased capacity of the recessed portion (at least 1.1 times the total volume) provides a universal solution that accommodates manufacturing variations without requiring additional components or complex adjustment mechanisms, thereby improving positioning accuracy without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9018663B2Lens-equipped optical semiconductor device and method for manufacturing the same

Publication Date: 2015.04.28 ASAHI RUBBER

AI summary

A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.