Resin Light Blocking for Compact Imaging Sensors
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Solution Overview
Problem
Conventional imaging apparatuses face challenges in downsizing due to the complexity of attaching an optical system with a light blocking wall, which requires precise positioning and increases the size of medical devices like endoscopes, making it difficult to block unnecessary external light effectively.
Innovation Solution
An ultrasmall imaging apparatus is designed with a translucent member and a resin material that shields external light, eliminating the need for a light blocking wall, allowing for easier attachment of the optical system and increased positioning flexibility, using a black resin to reinforce packaging strength and block external light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light blocking wall is used to shield external light, then external light blocking is improved, but device complexity and positioning precision requirements increase
Solution Approach 1:
The patent extracts the light blocking function from a separate structural component (light blocking wall) and integrates it into the resin material that is already present in the packaging. The resin material simultaneously provides packaging reinforcement and light blocking, eliminating the need for a dedicated light blocking wall structure.
Solution Approach 2:
The resin material is given multiple functions: it reinforces the packaging structure and simultaneously blocks external light. This multi-functional approach eliminates the need for separate light blocking components, reducing overall device complexity.
2Object-affected harmful factors
If a light blocking wall is used to shield external light, then external light blocking is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent removes the separate light blocking wall component and its associated precise positioning requirements. The light blocking function is achieved through the resin material that is applied during standard packaging processes, significantly easing manufacturing.
Solution Approach 2:
The resin material automatically provides light blocking coverage as it is applied to package the imaging sensor. The material self-adjusts to cover the necessary areas without requiring precise positioning fixtures or alignment procedures.
3Object-affected harmful factors
If a light blocking wall is used to shield external light, then external light blocking is improved, but device size increases
Solution Approach 1:
The resin material serves dual purposes as both packaging material and light blocking element. This eliminates the need for additional light blocking wall structures that would increase the overall device volume.
Solution Approach 2:
The patent merges the packaging function and light blocking function into a single resin material component. This consolidation eliminates the need for separate light blocking walls, thereby reducing the overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a compact imaging apparatus that can be readily attached to solid-state imaging sensors, effectively blocking external light without the need for precise positioning of a light blocking wall, facilitating the downsizing of medical devices like capsule endoscopes.
Implementation Method 1
a resin material which reinforces a bonding strength between a circuit board on which the solid-state imaging sensor is mounted and the electrode terminals of the solid-state imaging sensor, and shields a region outside the light receiving region of the translucent member from light
Implementation Method 2
The semiconductor chip receives light from an object through a light receiving surface and performs photoelectric conversion of the received light
Data Source
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AI summary
An object is to realize an imaging apparatus in which an optical system that focuses light from an object can be readily attached to a solid-state imaging sensor, and in which an unnecessary external light other than the light from the object can be blocked without fail. An imaging apparatus of the present invention includes a solid-state imaging sensor (2) that receives the light from the object and performs photoelectric conversion, an optical system (3) that focuses the light from the object, and a resin material (5). The solid-state imaging sensor (2) has a semiconductor chip which receives the light from the object through a light receiving surface and performs the photoelectric conversion. A translucent member is provided on an upper surface of the semiconductor chip and electrode terminals is provided on a lower surface of the semiconductor chip. The optical system (3) is provided on a light receiving region on a surface of the translucent member. The light receiving region faces the light receiving surface. The resin material (5) reinforces a bonding strength of a circuit board (4) on which the solid-state imaging sensor (2) is placed and the group of electrode terminals of the solid-state imaging sensor (2), and shields a region outside the light receiving region of the translucent member from light.