Resin-Covered Light Module for Wider LED Light Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting diode (LED) vehicle lamps have limited light emission area, leading to suboptimal design freedom and light distribution, due to their small size and narrow emission angle.
Innovation Solution
A lighting module with a substrate, multiple LEDs, a first resin layer covering the LEDs, and a second resin layer on top with wavelength conversion means and ink particles, which extends the light emission area and improves light distribution by including a cover structure that supports the module and enhances light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate components (housing, lens, LED chip, heat dissipation fin) are used to achieve functional requirements, then functional performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple separate components (housing, lens, LED chip, heat dissipation fin) into a single integrated light emitting module. The housing is formed as one piece with integrated LED chip mounting surfaces, lens mounting surfaces, and heat dissipation fins, eliminating the need for separate components and reducing assembly complexity while maintaining all necessary functions.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical support, optical coupling for the lens, electrical insulation, heat dissipation pathways, and mounting surfaces for the LED chip. This multi-functional design reduces the number of separate components needed while achieving all required functional performance.
2Manufacturing precision
If precise positioning of LED chip and lens is performed manually, then positioning precision is improved, but manufacturing time and cost increase
Solution Approach 1:
Positioning protrusions and positioning cavities are pre-formed during the molding process itself, before assembly. This preliminary positioning structure is created as part of the housing manufacturing, eliminating the need for manual positioning adjustments during assembly and enabling faster, more consistent manufacturing.
Solution Approach 2:
The positioning protrusions and cavities automatically align the LED chip and lens during assembly without requiring external positioning tools or manual adjustment. The structure itself provides the positioning function, making the assembly process self-aligning and more efficient.
3Ease of manufacture
If conventional molding processes are used for complex 3D housing structures, then manufacturing simplicity is improved, but manufacturing precision deteriorates due to shrinkage and deformation
Solution Approach 1:
Compensation structures (protrusions and cavities) are pre-formed during molding to counteract expected shrinkage and deformation. These structures are created as part of the molding process itself, allowing simple conventional molding to produce precise final dimensions by accounting for shrinkage in advance.
Solution Approach 2:
The molding process parameters and structure design are adjusted to compensate for material shrinkage and deformation tendencies. By incorporating compensation structures and adjusting molding conditions, the process maintains manufacturing simplicity while achieving precise dimensional accuracy in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved light extraction efficiency and uniform light distribution, reducing hot spots and allowing for flexible, slim surface light sources with enhanced design freedom and user convenience.
Implementation Method 1
a light emitting diode chip
Implementation Method 2
a resin, and a cap
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The lighting assembly disclosed in the embodiment of the invention includes a substrate, light emitting devices on the substrate, a first resin layer covering the light emitting devices, and at least one second resin layer on the first resin layer, and a first cover disposed on an outer periphery of the substrate along an outer periphery of the substrate of the lighting module. The second resin layer is disposed on upper and side surfaces of the first resin layer, and the second resin layer includes at least one of phosphor and ink particles. The first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed on an upper surface of the substrate around the opening portion, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion. An upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer.