Radiation-Sensitive Resin Composition for Lithography

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Solution Overview

Problem

Conventional radiation-sensitive resin compositions used in microfabrication, particularly with ArF excimer lasers, face challenges in achieving high sensitivity, balanced performance in MEEF, DOF, LWR, and CDU, and are impaired at higher heating temperatures during pattern formation.

Innovation Solution

A radiation-sensitive resin composition incorporating a polymer with specific structural units, including a monovalent lactone group and an ester group, dispersed along the polymer chain, which enhances solubility and acid reaction promotion, allowing for superior lithography properties and reduced heating temperature requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional radiation-sensitive resin compositions are used, then basic sensitivity is achieved, but lithography properties such as MEEF, DOF, LWR, and CDU are not highly balanced

Engineering Contradiction:
Improvelithography properties (MEEF, DOF, LWR, CDU)VSAvoidsensitivity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent uses a copolymer containing both alicyclic lactone structural units and non-alicyclic lactone structural units in a specific ratio (5-50 mol% alicyclic). This composite structure combines the high resolution and etch resistance benefits of alicyclic lactones with the sensitivity and processability advantages of non-alicyclic lactones, achieving highly balanced lithography properties while maintaining good sensitivity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the molecular weight of the polymer (10,000-100,000) and the ratio of alicyclic to non-alicyclic lactone units (5-50 mol%). By carefully controlling these parameters, the composition achieves the optimal balance between sensitivity, resolution, depth of focus, and other lithography metrics.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If heating temperature in pattern formation is comparatively high, then pattern formation is achieved, but resolution is impaired

Engineering Contradiction:
ImproveresolutionVSAvoidheating temperature
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent reduces the required heating temperature by optimizing the polymer structure. The specific copolymer composition with controlled molecular weight (10,000-100,000) and lactone unit ratios enables effective pattern formation at lower temperatures (60-110°C), preventing thermal diffusion that would degrade resolution while still achieving sufficient chemical amplification.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces specific local structural features - the alicyclic lactone units provide localized rigidity and etch resistance, while the non-alicyclic lactone units provide localized solubility and reactivity. This local differentiation allows the material to maintain high resolution at lower heating temperatures.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved sensitivity, balanced performance in MEEF, DOF, LWR, and CDU, while allowing for fine pattern formation at lower heating temperatures, reducing energy consumption and enhancing manufacturing efficiency.

Implementation Method 1

a radiation-sensitive resin composition which contains a lactone-containing (meth)acrylic polymer... a acid generating agent generating an acid upon irradiation with radioactive rays... generating the acid in light-exposed sites by irradiation with the radioactive rays, allowing chemical reactions catalyzed by the acid to occur

Methodology Applied
Scientific EffectPhotochemical reaction: Photopolymerisation

Implementation Method 2

heating the exposed resist film at a temperature of no greater than 110° C.

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS9158196B2Radiation-sensitive resin composition and pattern-forming method
Publication Date: 2015.10.13 JSR CORPORATION
  • US9158196B2 patent drawing
  • US9158196B2 patent drawing
  • US9158196B2 patent drawing

AI summary

A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.