Radiation-Sensitive Resin Composition for LSI Bump Plating
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Solution Overview
Problem
Current radiation-sensitive resin compositions used in producing bumps for LSI chips face challenges with swelling resistance to plating solutions, leading to potential leaks between the pattern and substrate, and poor resolution, especially when miniaturization requires longer plating times at low current densities.
Innovation Solution
A radiation-sensitive negative resin composition incorporating a polymer with specific structural units, a compound with ethylenically unsaturated double bonds, and a biimidazole-based radiation-sensitive radical polymerization initiator, which enhances adhesion, resolution, and heat resistance, preventing swelling and ensuring precise pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the resin film is soaked in plating solution for a long time to produce bumps at small pitches, then the production efficiency increases, but the resist pattern swells and the plating solution leaks in between the pattern and the substrate
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific monomers (hydroxystyrene, phenoxypolyethylene glycol methacrylate, carboxyl group-containing vinyl monomer) in optimized ratios to change the resin's swelling characteristics and chemical stability during prolonged plating exposure
Solution Approach 2:
The patent creates a composite resin system combining multiple polymer components with complementary properties - the hydroxystyrene provides adhesion and dimensional stability, the phenoxypolyethylene glycol methacrylate provides flexibility and stress relief, and the carboxyl group-containing monomer enhances chemical resistance, collectively preventing swelling and leakage
2Productivity
If the resin composition has high photosensitivity and photocurability to increase production efficiency, then the exposure speed increases, but the resolution deteriorates
Solution Approach 1:
The patent adjusts the photosensitivity parameters by selecting specific photopolymerizable compounds with appropriate absorption characteristics and curing kinetics to achieve optimal balance between exposure speed and pattern resolution
Solution Approach 2:
The patent creates local quality differentiation in the resin composition by using monomers with different functional groups that provide localized effects - hydroxystyrene for adhesion at the substrate interface, phenoxypolyethylene glycol methacrylate for bulk flexibility, and carboxyl group-containing monomers for surface chemical resistance, each contributing to overall pattern fidelity
3Reliability
If the resin film is made with good adhesion to prevent plating solution leakage, then the reliability increases, but the resin becomes more susceptible to swelling in plating solution
Solution Approach 1:
The patent develops a composite polymer structure where hydroxystyrene units provide strong adhesion to the substrate through hydrogen bonding and van der Waals forces, while the phenoxypolyethylene glycol methacrylate and carboxyl group-containing vinyl monomer units provide hydrophilic character and chemical stability that prevents swelling, creating a synergistic effect where adhesion and swelling resistance are simultaneously achieved
Solution Approach 2:
The patent creates local quality differentiation within the resin film by incorporating monomers with different functional groups that provide localized effects - hydroxystyrene for adhesion at the substrate interface, phenoxypolyethylene glycol methacrylate for bulk flexibility and stress relief, and carboxyl group-containing monomers for surface chemical resistance, each contributing to overall pattern fidelity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for high-precision production of thick bumps with uniform height, preventing plating solution leaks and maintaining pattern integrity during prolonged plating, thus supporting the miniaturization of LSI chips.
Implementation Method 1
a radiation-sensitive radical polymerization initiator (C)
Data Source
AI summary
A process is provided whereby thick platings such as bumps and wirings are produced with high precision while a resist shows high swelling resistance to a plating solution and the plating solution is prevented from leaking in between the pattern and substrate. A radiation-sensitive negative resin composition shows high sensitivity in the production process and possesses excellent resolution and heat resistance. A transfer film includes the composition. The radiation-sensitive negative resin composition includes (A) a polymer including a structural unit represented by Formula (1) and a structural unit represented by Formula (2) ; (B) a compound having at least one ethylenically unsaturated double bond; and (C) a radiation-sensitive radical polymerization initiator; wherein R1 is a hydrogen atom or a methyl group; R2 is a linear, cyclic or aromatic hydrocarbon group of 6 to 12 carbon atoms, or a substituted hydrocarbon group wherein at least one hydrogen atom in the linear, cyclic or aromatic hydrocarbon group is substituted with a hydrocarbon group; R3 is a hydrogen atom or a methyl group; R4 is -(CnH2n)-; m is an integer of 1 to 10; and n is an integer of 2 to 4.