Disposable Resin Mask for Plasma Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for forming masks in semiconductor processing, such as photolithography and laser beam irradiation, are costly and complex, making them unsuitable for low-cost mask formation in plasma etching applications.
Innovation Solution
A substrate processing method involving the formation of a lyophobic pattern, followed by a resin film that acts as a mask, using a combination of low and high viscosity liquids to ensure uniform coverage and easy removal, allowing for cost-effective mask formation and use in plasma etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form a mask, then the mask formation precision is improved, but the manufacturing cost increases
Solution Approach 1:
The patent uses a disposable mask film that is applied directly to the substrate and removed after plasma etching. This eliminates the need for expensive photolithography facilities while achieving sufficient mask formation precision for plasma dicing applications.
Solution Approach 2:
The patent replaces the complex optical-mechanical photolithography system with a simpler mechanical application process using a mask film and adhesive, significantly reducing facility costs while maintaining adequate precision for semiconductor wafer dicing.
2Productivity
If laser beam irradiation is used to eliminate scribe line area, then the mask formation speed is improved, but the facility cost increases
Solution Approach 1:
The patent employs a disposable mask film that can be quickly applied and removed, eliminating the need for expensive laser beam facilities. The mask film approach achieves comparable or better speed while dramatically reducing facility investment.
Solution Approach 2:
The patent extracts the essential function of mask formation from the expensive laser beam system and implements it through a simple adhesive-based mask film application process, removing the harmful factor of high facility cost while preserving the useful function of rapid mask creation.
3Reliability
If a thick resin film is formed for mask, then the etching resistance is improved, but the uniformity of film thickness decreases
Solution Approach 1:
The patent applies adhesive locally at the edges of the mask film to secure it to the substrate, allowing the central area to maintain uniform thickness. This localized bonding approach ensures etching resistance at the boundaries while preserving overall film uniformity.
Solution Approach 2:
The patent uses a flexible mask film with controlled thickness that can conform to the substrate surface, ensuring uniform thickness distribution while maintaining sufficient etching resistance through the film's material properties and adhesive bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of masks at a lower cost without the need for expensive facilities, ensuring efficient and precise plasma etching with smooth edges, reducing the risk of defects in semiconductor chips.
Implementation Method 1
printing, on a processing target surface of a substrate, a lyophobic liquid to an area to be etched away
Implementation Method 2
a mask formation step of curing the resin film, to thus form on the processing target surface a mask for covering an area except for the area to be etched away
Implementation Method 3
an etching step of etching the substrate from the processing target surface thereof by plasma processing
Data Source
AI summary
To provide a substrate processing method and a semiconductor chip manufacturing method that enable low-cost formation of a mask for etching using plasma etching. During formation of a mask used in plasma dicing for separating a semiconductor wafer 1 into discrete semiconductor chips 1e by means of etching using plasma processing, there is adopted a method including printing a lyophobic liquid in an area on a rear surface 1b that is to be an objective of etching, thereby forming a lyophobic pattern made up of lyophobic films 3; supplying a low viscosity resin 4a and a high viscosity resin 4b, in this sequence, to the rear surface 1b on which the lyophobic pattern is formed, thereby forming a resin film 4 that is thicker than the lyophobic films 3 in an area where the lyophobic films 3 are not present; and curing the resin film 4, to thus form a mask 4* that covers an area except for the area to be etched. Thus, a mask for etching purpose can be formed at low cost without use of a high-cost method, like photolithography.