Resin Material Thermal Conductivity Adhesiveness
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Solution Overview
Problem
Conventional thermally conductive sheets containing boron nitride face challenges in achieving both enhanced thermal conduction and adhesiveness, leading to insulation property degradation and reduced long-term reliability due to void generation and peeling of circuit patterns in laminates.
Innovation Solution
A resin material comprising specific inorganic particles with varying aspect ratios and circularities, combined with a binder resin, is used to create a laminate with an insulating layer that enhances insulation properties, adhesiveness, and long-term reliability by controlling the orientation of particles for improved thermal conduction and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hexagonal boron nitride particles are used to enhance thermal conduction, then thermal conductivity is improved, but adhesiveness deteriorates due to particle orientation and void formation
Solution Approach 1:
The patent changes the aspect ratio parameter of boron nitride particles from high (hexagonal) to low (2.0 or less), transforming the particle morphology from scaly to more equiaxial. This parameter change enables particles to orient in the thickness direction during molding, improving both thermal conduction and adhesiveness by eliminating void formation while maintaining interfacial bonding strength
Solution Approach 2:
The patent creates a composite resin composition containing low aspect ratio boron nitride particles dispersed in a thermosetting resin matrix. This composite structure allows the filler particles to provide thermal conduction pathways while the resin matrix maintains adhesiveness and structural integrity, resolving the contradiction between thermal performance and bonding strength
2Reliability
If ceramic substrate is used for heat dissipation, then thermal conduction is improved, but processability and multilayer formation deteriorate
Solution Approach 1:
The patent replaces expensive, difficult-to-process ceramic substrates with a cost-effective resin-based composite material that achieves comparable thermal performance. The resin composition uses readily processable thermosetting resin with simple molding processes, eliminating the complexity of ceramic fabrication while providing sufficient heat dissipation for electronic applications
Solution Approach 2:
The patent changes the material composition parameter from ceramic to resin-based composite, fundamentally altering the processing characteristics. The resin system allows for low-temperature curing, multilayer lamination, and flexible manufacturing processes that are impossible with ceramic substrates, while the embedded boron nitride particles maintain thermal conduction capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin material effectively enhances insulation properties, adhesiveness, and long-term reliability by optimizing the thermal conductivity and bonding between the resin sheet and conductive layers, reducing peeling and void formation, thereby improving the laminate's performance.
Implementation Method 1
hexagonal boron nitride has a property that the thermal conductivity in the plane direction is higher than the thermal conductivity in the thickness direction, and the thermal conductivity is anisotropic
Implementation Method 2
enhances adhesiveness, and long-term reliability by optimizing the thermal conductivity and bonding between the resin sheet and conductive layers
Data Source
AI summary
Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.