Resin Composition for Stable Metal-Conductive Layer Adhesion
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Solution Overview
Problem
The existing resin compositions used in electronic devices with metallic conductive layers face challenges in adhesiveness and stability at the interface between the metallic conductive layer and the resin layer, particularly at high temperatures, leading to inferior light transmittance and separation issues.
Innovation Solution
Incorporating a specified amount of a nitrogen-containing aromatic heterocyclic compound into the resin or resin precursor, which interacts with the metal in the metallic conductive layer to enhance adhesiveness and stability, thereby forming a resin composition that is favorable for both high temperature storage and light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer is placed under a metallic conductive layer, then the resin layer provides structural support and electrical insulation, but adhesiveness at the interface deteriorates and separation occurs during high temperature storage
Solution Approach 1:
The patent introduces a specific nitrogen-containing aromatic heterocyclic compound as an intermediary substance between the resin layer and metallic conductive layer. This compound contains nitrogen atoms that can coordinate with metal atoms, forming a chemical bridge that enhances adhesion while maintaining stability during high temperature storage.
Solution Approach 2:
The patent modifies the chemical composition parameters of the resin layer by incorporating nitrogen-containing aromatic heterocyclic compounds with specific structural characteristics. This changes the chemical properties of the resin to improve both adhesiveness and thermal stability simultaneously.
2Reliability
If silver is used as a metallic conductive layer material, then electrical conductivity is improved, but the metal aggregates and forms a sea-island structure leading to inferior light transmittance
Solution Approach 1:
The nitrogen-containing aromatic heterocyclic compound acts as a mediator between silver atoms and the resin matrix, preventing silver aggregation by providing coordination sites that distribute metal atoms uniformly throughout the resin layer, thereby maintaining both conductivity and optical properties.
Solution Approach 2:
The patent creates local regions where nitrogen-containing heterocyclic compounds coordinate with metal atoms, forming discrete interaction sites that prevent bulk aggregation while maintaining overall film uniformity and light transmittance.
3Illumination intensity
If the metallic conductive layer is made thinner to improve light transmittance, then optical performance is improved, but adhesiveness deteriorates and separation progresses in high temperature storage
Solution Approach 1:
The nitrogen-containing aromatic heterocyclic compound serves as a chemical intermediary that strengthens the interface between the thin metallic conductive layer and the resin substrate, enabling the layer to be made thinner for improved light transmittance while maintaining adhesion through chemical coordination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition exhibits improved adhesiveness to the metallic conductive layer, stability in high temperature storage, and excellent light transmittance, ensuring a thin and stable metallic conductive layer for electronic devices.
Implementation Method 1
the nitrogen-containing aromatic heterocyclic compound... allow for interaction with a metal in a metallic conductive layer and suppression of diffusion of the metal
Data Source
AI summary
A resin composition includes a resin or a resin precursor, and a nitrogen-containing aromatic heterocyclic compound. The nitrogen-containing aromatic heterocyclic compound has a structure represented by the following general formula (1), the following general formula (6) or the following general formula (7):In the general formula (1), A1 and A2 each represent a 6-membered nitrogen-containing aromatic heterocyclic ring together with a nitrogen atom, and the 6-membered nitrogen-containing aromatic heterocyclic ring optionally forms a fused ring; and L represents a single bond, or a linking group derived from an aromatic hydrocarbon ring, an aromatic heterocyclic ring, or an alkyl group. The resin composition includes the nitrogen-containing aromatic heterocyclic compound in a range from 0.10 to 30% by mass relative to the resin or the resin precursor.