Resin Composition for Microlens Etching Rate Matching
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Solution Overview
Problem
Existing microlens production methods for CCD/CMOS image sensors face challenges in achieving high transparency, heat resistance, solvent resistance, and flatness, with dry etching rates of resist and resin layers not being substantially equal, leading to issues in lens shape deformation and mixing with organic solvents during high-temperature processing.
Innovation Solution
A thermosetting resin composition comprising specific copolymers with structural units such as blocked isocyanate and carboxy groups, which self-cross-link, providing excellent storage stability, transparency, heat resistance, and solvent resistance, and matching dry etching rates with resist layers, suitable for forming microlenses and planarizing films using the etch back method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional thermosetting resins are used for microlens production, then heat resistance and transparency can be achieved, but the dry etching rate does not match the resist layer, causing lens shape deformation
Solution Approach 1:
The patent modifies the chemical composition parameters of the thermosetting resin by incorporating specific functional groups (carboxy, hydroxy, amino groups) in controlled ratios. This changes the etching rate parameter to match the resist layer while maintaining other critical properties like heat resistance and transparency.
Solution Approach 2:
The patent creates a composite resin system combining thermosetting base resin with added functional components (carboxy-containing compounds, hydroxy-containing compounds, amino-containing compounds). This composite structure achieves the desired etching rate matching while preserving the inherent advantages of thermosetting resins.
2Shape
If high-temperature processing is applied to form microlenses, then lens shaping is achieved, but resin deformation and exfoliation occur due to mixing with organic solvents
Solution Approach 1:
The patent adjusts the chemical parameter of the resin by introducing functional groups with specific thermal and chemical stability characteristics. These modified parameters enable the resin to withstand high-temperature processing without deformation or exfoliation while maintaining compositional stability.
Solution Approach 2:
The patent enhances specific local properties of the resin by concentrating functional groups (carboxy, hydroxy, amino) in strategic positions within the molecular structure. This local enhancement provides targeted resistance to thermal and chemical degradation at critical stress points during processing.
3Temperature
If cross-linking agents are added to improve heat resistance, then thermal stability increases, but storage stability decreases due to premature cross-linking
Solution Approach 1:
The patent enables the resin to perform its own cross-linking function through self-crosslinkable functional groups (carboxy, hydroxy, amino groups) that react under processing conditions without requiring external cross-linking agents. This self-service mechanism ensures cross-linking occurs only when needed, maintaining storage stability while achieving heat resistance.
Solution Approach 2:
The patent incorporates pre-reactive functional groups into the resin structure during manufacturing, but these groups remain dormant during storage. Under high-temperature processing conditions, these pre-positioned groups become activated and perform the cross-linking action, providing heat resistance without compromising storage stability.
4Temperature
If thermosetting resin is used for microlens formation, then heat resistance is achieved, but solvent resistance and flatness are insufficient
Solution Approach 1:
The patent creates a composite resin formulation combining thermosetting base material with functional additives (carboxy-containing, hydroxy-containing, and amino-containing compounds). This composite structure provides simultaneous improvement in solvent resistance and flatness while maintaining the heat resistance inherent to thermosetting resins.
Solution Approach 2:
The patent modifies multiple chemical parameters of the resin system by introducing functional groups with specific molecular characteristics. These parameter changes collectively enhance solvent resistance through improved molecular interactions and achieve better flatness through controlled curing shrinkage, while preserving heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures reduced deformation and exfoliation of microlenses during high-temperature processing, maintaining transparency and flatness, and achieving matching dry etching rates with resist layers, making it suitable for microlens and planarizing film applications.
Implementation Method 1
a copolymer having structural units of Formula (1), Formula (2), and Formula (3) or a copolymer having structural units of Formula (1), Formula (4), and Formula (5)... The structural unit of Formula (2) has a blocked isocyanate group and the structural unit of Formula (4) has a blocked carboxy group
Implementation Method 2
The resin composition of the present invention is, for example, a resin composition for a microlens or a resin composition for a planarizing film... A film formed from the resin composition of the present invention has excellent transparency, heat resistance, solvent resistance, and flatness
Data Source
AI summary
There is provided a resin composition including a copolymer having structural units of Formula (1), Formula (2), and Formula (3), and a solvent; or a resin composition including a copolymer having structural units of Formula (1), Formula (4), and Formula (5), and a solvent.
