Resin Mold Composition for Imprinting Durability
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Solution Overview
Problem
The existing methods for manufacturing molds for imprinting techniques, such as photo and thermal imprinting, are costly and time-consuming, and there is a need for a resin mold with improved durability and mold release properties that can withstand repeated use without significant deterioration.
Innovation Solution
A composition comprising compounds with acryloyl or methacryloyl groups and perfluoroalkylene groups, which form a resin with high stability and cross-linking, allowing for the creation of a durable resin mold that can be cured without heat and maintains its properties during repeated use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molds are prepared by semiconductor fine processing technologies or electric casting methods, then manufacturing precision and reliability are improved, but manufacturing cost increases and preparation time extends
Solution Approach 1:
The invention applies preliminary action by pre-forming a master mold with high precision patterns using conventional methods, then using this master mold to create multiple resin molds through a simplified replication process. This allows the time-consuming precision work to be done once, rather than for each individual mold needed.
Solution Approach 2:
The invention uses copying by creating resin molds that replicate the pattern from a master mold. The resin composition is cured against the master mold surface, transferring the pattern to the resin mold, which can then be used repeatedly without requiring the same complex manufacturing process each time.
2Productivity
If resin molds are used to reduce cost and preparation time, then manufacturing efficiency is improved, but durability and mold release properties deteriorate
Solution Approach 1:
The invention uses composite materials by combining a photopolymerizable compound with specific functional groups (acryloyl or methacryloyl) and a perfluoroalkylene group. The perfluoroalkylene group provides excellent mold release properties and chemical inertness, while the photopolymerizable groups enable cross-linking for durability. This composite molecular structure achieves both ease of manufacture and high reliability.
Solution Approach 2:
The invention applies parameter changes by modifying the chemical structure of the resin composition to include perfluoroalkylene groups, which fundamentally change the surface properties and bonding characteristics of the cured resin. This chemical parameter change enables the resin mold to have both good release properties and high durability simultaneously.
3Ease of manufacture
If conventional resin compositions are used for mold fabrication, then ease of manufacture is maintained, but cross-linking density and resistance to swelling decrease
Solution Approach 1:
The invention changes the chemical parameters of the resin composition by incorporating compounds with perfluoroalkylene groups and photopolymerizable groups. This enables high cross-linking density upon curing while maintaining ease of manufacture through photopolymerization. The specific molecular structure provides both manufacturing simplicity and compositional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin mold exhibits excellent durability and mold release properties, enabling repeated formation of photocured layers with minimal swelling and surface roughness, thus supporting the efficient transfer of fine patterns in imprinting processes.
Implementation Method 1
a photopolymerizable compound (A) having a substituent (a) which is at least either one of an acryloyl group and a methacryloyl group, and a perfluoroalkylene group
Data Source
AI summary
Described is a composition comprising: a compound (A) having a substituent (a) being at least either one of an acryloyl group and a methacryloyl group, and a perfluoroalkylene group; and a compound (B) having a substituent (b) being either one of an acryloyl group and a methacryloyl group, and a substituent (c) being either one of an acryloyl group and a methacryloyl group.