Resin-Molded Cable Substrate Joint for High-Density Slots
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Solution Overview
Problem
The existing communication cables, particularly multi-core cables, are prone to damage when subjected to forces exceeding the assumed range due to the lack of resin molding at the connection portions between core cables and the substrate, leading to potential peeling off of solder joints and connection failures.
Innovation Solution
The communication cable incorporates a resin portion that molds the connection between the cable and the substrate, specifically covering and securing the joint portions between the signal lines and shield members with the substrate, enhancing the durability against applied forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of slots are arranged with high density on the communication device, then the number of slots increases to achieve high function and high speed, but the degree of freedom in handling communication cables is lowered and bending force and tensile force are applied to the cables
Solution Approach 1:
The patent applies beforehand cushioning by introducing a resin portion that molds and protects the connection portion between the cable and substrate before any damage can occur. This resin cushioning structure prevents bending force and tensile force from directly acting on the solder joints and connection terminals, thereby protecting the electrical connection even when cables are subjected to stress in high-density slot arrangements.
2Adaptability or versatility
If the cable is subjected to bending force and tensile force, then the cable flexibility is maintained, but the connection portion between the cable and substrate is damaged due to lack of resin molding
Solution Approach 1:
The resin portion is molded in advance to cover and protect the connection portion between the cable and substrate. This beforehand cushioning structure absorbs and distributes bending force and tensile force, preventing these forces from concentrating on the solder joints and connection terminals, thereby maintaining connection reliability even when the cable is flexed or pulled.
Solution Approach 2:
The patent employs composite materials by combining the resin portion with the cable and substrate assembly. The resin material provides protective properties that complement the mechanical properties of the cable and substrate, creating a composite structure that simultaneously maintains cable flexibility and protects the connection portion from damage.
3Reliability
If resin molding is applied to the connection portion, then the durability against applied forces is enhanced, but the device complexity increases
Solution Approach 1:
The patent applies merging by integrating the resin portion molding process with the existing cable connection process. The resin portion is molded to collectively secure multiple connection portions (signal lines and shield members) in a single operation, rather than treating each connection separately. This merging approach enhances connection durability while minimizing the increase in device complexity.
Data Source
AI summary
In a communication cable having a multi-core cable with a plurality of core cables in which a pair of signal lines are covered with an insulator, in which the insulator is covered with a shield tape, and in which the shield tape is covered with a wrapping tape, and having a connector formed on an end portion of the multi-core cable, the communication cable further has a case which is inserted/removed to/from a slot formed on a communication device to which the communication cable is connected, a substrate which is housed in the case and to which an end portion of the multi-core cable is connected, and a resin portion which molds a connection portion between the end portion of the multi-core cable and the substrate.