Resin Molded Connector with Flat Bend Surfaces

The patent applies preliminary action by pre-forming flat surfaces on the inner peripheral edges of the bend before the molding process. These flat surfaces are created during the bending process itself, ensuring that when the mold contacts the conductive plate during secondary molding, there is a precise contact surface that prevents resin leakage. This preliminary preparation of the surface geometry resolves the contradiction by maintaining both thickness for strength and precision for reliable molding.

The patent applies local quality by creating flat surfaces only at the specific location where mold contact is needed (the inner peripheral edges of the bend), rather than making the entire side edges flat. This localized approach ensures reliable mold contact and prevents resin leakage at the critical bonding interface, while maintaining the natural width variations elsewhere on the conductive plate. The flat surfaces are precisely positioned to provide consistent contact points for the mold, eliminating the need for mold adjustment while preserving molding efficiency.

The patent applies preliminary action by pre-forming flat surfaces on the inner peripheral edges of the bend during the bending process itself, before the secondary molding operation. These flat surfaces serve as predetermined contact surfaces that ensure reliable mold contact without requiring subsequent adjustments to the mold arrangement. By preparing the contact surfaces in advance as an integral part of the bending process, the patent eliminates the need for complex mold adjustments for each conductive plate, thereby maintaining high work efficiency while ensuring molding reliability.