Resin Molded Substrate With Pins For Warping Control
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Solution Overview
Problem
Thin and miniaturized semiconductor devices face challenges in maintaining structural integrity during solder reflow processes, leading to warping and pin entrapment issues, and the manufacturing of substrates with pins is complex and requires specific brazing materials.
Innovation Solution
A substrate with pins is created using a resin substrate where pins are molded with varying configurations, such as flush, protruding, or locked ends, and a resin molding process that includes a film to prevent resin infiltration, allowing for easy bonding and high-density pin arrangements, and using a reinforcing material to support the wiring substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin wiring substrate is used for miniaturization, then the device size is reduced, but the substrate strength decreases causing warping during solder reflow
Solution Approach 1:
The patent uses a composite structure consisting of a thin wiring substrate combined with a support substrate. The wiring substrate provides miniaturization while the support substrate provides mechanical strength. This composite structure allows the thin substrate to maintain its size advantages while the support substrate prevents warping during solder reflow processes.
Solution Approach 2:
The support substrate acts as an intermediary element between the thin wiring substrate and the external environment. It provides the necessary mechanical support and stability during manufacturing processes, particularly during solder reflow, without interfering with the miniaturization goals of the wiring substrate itself.
2Device complexity
If pins are bonded directly to a thin wiring substrate, then the manufacturing process is simplified, but the pin bonding strength is insufficient due to substrate deformation
Solution Approach 1:
The composite structure of wiring substrate plus support substrate provides a stable bonding surface for pins. The support substrate prevents deformation during bonding operations, ensuring sufficient pin bonding strength while allowing the overall manufacturing process to remain relatively simple.
Solution Approach 2:
The patent employs a mold with a curved bottom surface that corresponds to the pin arrangement pattern. This curved mold design allows pins to be precisely positioned and bonded to the substrate in a single operation, simplifying the manufacturing process while ensuring strong bonding through proper alignment and contact.
3Stability of the object's composition
If a support jig is used during solder reflow, then the substrate is supported, but the jig cannot be removed when the substrate warps causing pin entrapment
Solution Approach 1:
The support substrate integrated into the composite structure provides continuous stability during solder reflow without requiring external support jigs. This eliminates the pin entrapment problem because the substrate maintains its shape throughout the heating and cooling cycles, allowing easy removal of any temporary fixtures used.
Solution Approach 2:
The patent extracts the support function from external support jigs and integrates it directly into the substrate structure itself. The support substrate becomes an inherent part of the assembly, providing stability during reflow without creating the removal problems associated with separate support fixtures.
4Strength
If pins are inserted into through holes and brazed, then the pin bonding strength is increased, but the manufacturing steps become complicated and material selection is restricted
Solution Approach 1:
The patent replaces the mechanical brazing process with a molding process. Pins are positioned in a mold cavity, and resin is injected to bond the pins to the substrate. This substitution eliminates the need for brazing materials and complex multi-step processes, achieving sufficient bonding strength through a simpler, more flexible manufacturing method.
Solution Approach 2:
The patent changes the bonding method from thermal brazing to chemical/mechanical bonding through resin molding. This parameter change in the bonding process allows for greater material selection flexibility and simplifies the manufacturing steps while maintaining adequate pin bonding strength for the application.
Data Source
AI summary
A semiconductor product is constructed of a wiring substrate in which pads for pin connection are formed, and a substrate with pins in which pins are disposed. The substrate with the pins is formed so that one end of the pin is exposed to one surface of a resin substrate formed by resin molding and the other end of the pin extends from the other surface of the resin substrate and one end of the pin is bonded to a pad of the wiring substrate through a conductive material.