Resin-Molded Electronic Component Assembly for Terminal Alignment
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Solution Overview
Problem
Existing methods for producing resin mold-type electronic components face challenges in accurately aligning metal terminals with terminal electrodes, leading to misalignment issues when covered with mold resin for moisture resistance, which affects the reliability of the joint and overall component performance.
Innovation Solution
The method involves using a first mold resin with an accommodating portion and a joining material filling space to facilitate accurate alignment and joining of metal terminals with terminal electrodes, followed by covering with a second mold resin to enhance moisture resistance, utilizing a design that includes recess portions and vertical metal terminal portions to ensure proper filling and connectivity of the joining material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment is performed manually between terminal electrode and metal terminal, then positioning can be achieved, but it takes time and effort and may result in misaligned state
Solution Approach 1:
The mold resin structure provides self-alignment functionality through its design. The accommodating portion with positioning protrusions and the metal terminal with corresponding positioning recesses create a self-aligning system that automatically positions components correctly during molding, eliminating the need for manual alignment operations.
Solution Approach 2:
The mold resin is designed in advance with built-in positioning features (protrusions and recesses) that pre-establish the correct alignment relationship between the terminal electrode and metal terminal before the actual joining process occurs. This preliminary structural design ensures accurate positioning without requiring subsequent adjustment operations.
2Ease of manufacture
If metal terminal is joined to terminal electrode in misaligned state, then joining can be completed, but moisture resistance is compromised
Solution Approach 1:
The mold resin structure provides self-alignment functionality through its design. The accommodating portion with positioning protrusions and the metal terminal with corresponding positioning recesses create a self-aligning system that automatically positions components correctly during molding, eliminating the need for manual alignment operations.
Solution Approach 2:
The mold resin is designed in advance with built-in positioning features (protrusions and recesses) that pre-establish the correct alignment relationship between the terminal electrode and metal terminal before the actual joining process occurs. This preliminary structural design ensures accurate positioning without requiring subsequent adjustment operations.
3Ease of operation
If manual alignment process is used, then positioning can be attempted, but misalignment occurs leading to poor joint reliability
Solution Approach 1:
The mold resin structure provides self-alignment functionality through its design. The accommodating portion with positioning protrusions and the metal terminal with corresponding positioning recesses create a self-aligning system that automatically positions components correctly during molding, eliminating the need for manual alignment operations.
Solution Approach 2:
The mold resin is designed in advance with built-in positioning features (protrusions and recesses) that pre-establish the correct alignment relationship between the terminal electrode and metal terminal before the actual joining process occurs. This preliminary structural design ensures accurate positioning without requiring subsequent adjustment operations.
Data Source
AI summary
A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.


