Resin Molding Plunger Control for Dimensional Accuracy
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Solution Overview
Problem
The increasing demand for precision in resin molded articles necessitates improved production methods to achieve higher accuracy in resin molding devices.
Innovation Solution
A resin molding device with a controller that adjusts the position of the plunger based on the volume of the chip and resin material, using a transfer mechanism to control the resin filling rate, and a method that measures and calculates the relationship between the plunger position and resin filling rate to enhance precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin molding methods are used, then the production process is simple, but the manufacturing precision of resin molded articles is insufficient
Solution Approach 1:
The patent implements feedback control by measuring the actual resin filling rate during the molding process and comparing it with the target filling rate. The controller adjusts the plunger position and molding parameters based on this feedback to maintain high manufacturing precision. This closed-loop control system ensures that dimensional accuracy is achieved while managing device complexity through intelligent control rather than purely mechanical solutions.
Solution Approach 2:
The patent employs parameter changes by dynamically adjusting multiple molding parameters including plunger position, injection speed, and cavity pressure based on the measured resin filling rate. The controller modifies these parameters in real-time to optimize the molding process, achieving high precision through coordinated parameter adjustment rather than relying on a single complex mechanical mechanism.
2Manufacturing precision
If the plunger position is adjusted to control resin filling rate, then manufacturing precision improves, but the device complexity increases due to additional control mechanisms
Solution Approach 1:
The patent replaces complex mechanical adjustment mechanisms with an automated control system that uses sensors and controllers to manage plunger position and resin filling rate. Instead of relying on purely mechanical linkages and adjustments, the system uses electronic control to achieve precise filling rate management, reducing the complexity of mechanical components while improving control accuracy.
Solution Approach 2:
The system implements self-service control where the controller automatically adjusts the plunger position and molding parameters based on real-time measurement of the resin filling rate. The system monitors its own performance and makes autonomous adjustments without requiring external intervention, thereby managing the complexity of control mechanisms through self-regulation.
3Manufacturing precision
If multiple measurements and calculations are performed to determine plunger position relationship, then manufacturing precision increases, but the production time increases
Solution Approach 1:
The patent applies preliminary action by pre-establishing the relationship between plunger position and resin filling rate through advance measurement and calculation. The controller uses pre-measured values of chip volume and resin material volume to calculate the theoretical filling rate curve before the actual molding process begins. This allows the system to have ready-to-use reference data during production, reducing real-time calculation time while maintaining high precision.
Solution Approach 2:
The patent ensures continuity of useful action by performing measurements and calculations continuously during the molding process rather than as discrete pre-processing steps. The sensor continuously monitors the resin filling rate, and the controller continuously adjusts parameters based on this continuous feedback, eliminating idle time between measurement and action. This continuous operation maintains precision while minimizing production time delays.
Data Source
AI summary
The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.