Electronic Component Package Resin Multilayer Cutting
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Solution Overview
Problem
The existing manufacturing process for electronic component packages faces challenges with structural defects due to abrupt changes in cutting hardness, leading to dicing saw blade wear and potential separation of the coupled unit from the resin layer, which affects moisture resistance and manufacturing efficiency.
Innovation Solution
The electronic component package incorporates a multilayer body with a resin film and pattern conductor laminated together, including via conductors connected to an outer conductor, which is partially covered by a resin layer, and a conductor film is applied to connect with the pattern conductor's circumference, allowing for smoother cutting and reduced structural defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dicing saw blade cuts through the coupled resin layer and reaches the coupled unit made of metal, then the cutting process completes the separation of individual packages, but the abrupt change in hardness causes accelerated blade wearing out and may require blade replacement
Solution Approach 1:
The patent changes the material parameter of the coupled unit from metal to resin, matching the hardness characteristics of the surrounding resin layer. This parameter change eliminates the abrupt hardness transition during cutting, allowing continuous operation without blade replacement and maintaining manufacturing efficiency.
Solution Approach 2:
The patent makes the coupled unit homogeneous with the resin layer by using the same resin material. This homogeneity ensures uniform cutting resistance throughout the cutting process, preventing blade wear acceleration and enabling smooth continuous cutting without interruptions for blade replacement.
2Ease of manufacture
If the dicing saw blade pushes the coupled unit made of metal, then the cutting process progresses through the package aggregate, but the coupled unit separates from the coupled resin layer causing structural defects
Solution Approach 1:
The patent changes the material parameter of the coupled unit from metal to resin, which fundamentally alters the mechanical interaction during cutting. The resin material deforms and bonds with the surrounding resin layer during cutting, preventing separation and maintaining structural integrity while still allowing the cutting process to proceed.
Solution Approach 2:
The patent uses composite material construction where the coupled unit is made of resin that is chemically and mechanically compatible with the surrounding resin layer. This composite approach ensures that the interface between the coupled unit and resin layer maintains strong bonding during the cutting process, preventing structural defects.
3Productivity
If the coupled unit made of metal is cut with the dicing saw blade, then the individual packages are separated, but the hardness difference causes distortion and breakage of the blade
Solution Approach 1:
The patent changes the hardness parameter of the coupled unit by replacing metal with resin material. This parameter change ensures that the coupled unit has the same hardness characteristics as the surrounding resin layer, eliminating the conditions that cause blade distortion and breakage while still achieving effective package separation.
Data Source
AI summary
An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).