Resin Multilayer Substrate Intermediate Layer for Short Circuit Prevention
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Solution Overview
Problem
Existing resin multilayer substrates face challenges in preventing short circuits between conductor patterns due to gaps and positional inaccuracies during thermocompression bonding, leading to potential contact and deformation issues.
Innovation Solution
A resin multilayer substrate configuration that includes an intermediate resin material layer with no conductor pattern, strategically positioned between insulating base materials with conductor patterns, which extends over both the intermediate and end regions to prevent gaps and ensure proper alignment, thereby preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a paint layer is placed at a region with no conductor pattern to eliminate difference in level, then the level difference is reduced, but gaps appear between the paint layer and conductor pattern leading to short circuits
Solution Approach 1:
An intermediate resin material layer is introduced between the paint layer and the conductor pattern on the lower layer. This intermediate layer acts as a mediator that fills the gap created by the paint layer, preventing direct contact between vertically adjacent conductor patterns while maintaining the level difference elimination function.
Solution Approach 2:
The resin material is divided into multiple functional layers: a paint layer for eliminating level difference and an intermediate resin material layer for preventing short circuits. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between level elimination and short circuit prevention.
2Stability of the object's composition
If thermocompression bonding is performed to integrate insulating base materials, then the substrate is integrated, but conductor patterns deform and deflect into gaps causing short circuits
Solution Approach 1:
The intermediate resin material layer is placed beforehand between the conductor patterns before thermocompression bonding occurs. This intermediate layer provides cushioning and support during the bonding process, preventing the conductor patterns from deforming and deflecting into gaps that would cause short circuits.
3Measurement precision
If positional accuracy is improved to eliminate gaps, then short circuit prevention is enhanced, but manufacturing complexity increases
Solution Approach 1:
Instead of relying solely on high positional accuracy, the invention changes the structural parameter by introducing an intermediate resin material layer. This parameter change provides a physical barrier that ensures short circuit prevention even when positional accuracy varies within normal manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The intermediate resin material layer effectively prevents short circuits between adjacent conductor patterns by eliminating gaps and ensuring accurate alignment, enhancing the reliability of the substrate configuration.
Implementation Method 1
a first insulating base material, an intermediate resin material layer, and a second insulating base material are stacked in this order from the second side to the first side, the intermediate resin material layer includes an intermediate region whose surface on the second side is in contact with the main surface of the first side of the second insulating base material
Data Source
AI summary
A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.