Resin Multilayer Substrate Via Segmentation Coplanarity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Resin multilayer substrates face issues with electrical short circuits due to the high stiffness of serial via sections and incorporated components, leading to coplanarity degradation and improper component mounting, which can result in electrical shorts and breaks in the via sections during integration.
Innovation Solution
The design includes a multilayer body with a plurality of resin layers, where the first and second conductive vias are positioned at different heights and not aligned with the first conductive via, reducing the overlap and stiffness of serial via sections, and incorporating components with terminals that are spaced to prevent contact and tilting, thereby maintaining coplanarity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the serial via section is made with high stiffness to maintain structural integrity, then the via section is stronger, but the coplanarity of the top surface degrades when pressed for integration
Solution Approach 1:
The conductive via structure is divided into multiple separate via sections (first conductive via, second conductive via, third conductive via) rather than a single continuous rigid structure. This segmentation allows each via section to independently accommodate pressing forces during integration, preventing coplanarity degradation while maintaining electrical connectivity through the flexible resin layers.
2Reliability
If the serial via section has high stiffness, then electrical connectivity is maintained, but electrical short circuits occur when via sections contact during pressing
Solution Approach 1:
The conductive vias are embedded in flexible resin layers that can deform during pressing operations. The resin layers act as flexible matrices that accommodate the pressing forces, allowing the via sections to maintain their electrical connectivity while preventing rigid contact between adjacent via sections, thus avoiding electrical short circuits.
3Area of stationary object
If components are spaced closely to reduce substrate size, then area is reduced, but distortion of serial via sections occurs during pressing
Solution Approach 1:
The invention changes the mechanical parameters of the resin layers, specifically making them softer with lower storage modulus values (first resin layer: 10-100 MPa, second resin layer: 100-1000 MPa). This parameter change allows the resin to deform and absorb pressing forces, preventing distortion of the serial via sections even when components are closely spaced, thereby maintaining shape stability.
Data Source
AI summary
A resin multilayer substrate includes a multilayer body including resin layers mainly made of thermoplastic resin and that are laminated, a first component incorporated in the multilayer body and including a first component terminal, a second component incorporated in the multilayer body, including a second component terminal, spaced away from the first component as seen from a laminating direction of the multilayer body, a first conductive via electrically connected to the first component terminal and overlapping the first component terminal as seen from the laminating direction of the multilayer body, and a plurality of second conductive vias not aligned with the first conductive via, disposed closer to the second component, disposed at heights different from a height of the first conductive via, and electrically connected to the first conductive via.