Resin Dispensing Nozzle Venting for Quadrangular Paste Spreading
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses struggle to spread resin paste in a quadrangular shape, leading to unintended shapes and bonding issues due to air escape and resin oozing from the ends of the cross groove.
Innovation Solution
A semiconductor manufacturing apparatus with a nozzle featuring a cross groove, a supply hole at the center, and exhaust grooves at the ends that are shallower than the cross groove, allowing air to escape while preventing resin paste from oozing out, thus enabling the resin paste to spread in a quadrangular shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air is allowed to escape from the center of the cross groove, then air traps are eliminated, but resin paste oozes from the ends of the cross groove together with the air
Solution Approach 1:
The exhaust function is segmented from the cross groove by creating separate exhaust grooves that extend from the ends of the cross groove to the outside of the bottom surface. This segmentation allows air to escape through dedicated pathways while the cross groove retains resin paste, resolving the contradiction between air trap elimination and shape control.
Solution Approach 2:
Different regions of the nozzle bottom surface are given different depths: the cross groove has a greater depth to hold resin paste, while the exhaust grooves are shallower to allow air escape. This local quality differentiation enables simultaneous air venting and resin containment.
2Shape
If the cross groove is filled with resin paste, then the resin paste can be applied in a cross shape, but air cannot escape and causes defects
Solution Approach 1:
The nozzle bottom surface is segmented into functional zones: the cross groove for resin paste application and the exhaust grooves for air escape. This segmentation allows the cross shape to be maintained while providing dedicated air venting pathways.
Solution Approach 2:
The exhaust grooves act as intermediary pathways that facilitate air escape without interfering with the cross groove's resin paste holding function. These grooves mediate between the sealed cross groove and the external environment, allowing air to escape while resin paste remains contained.
3Reliability
If the exhaust grooves are deeper than the cross groove, then air can escape more effectively, but resin paste leaks into the exhaust grooves
Solution Approach 1:
The exhaust grooves are designed with shallower depth compared to the cross groove, creating a local quality difference that prevents resin paste from leaking into the exhaust pathways while still allowing air to escape effectively from the bottom surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively spreads resin paste in a quadrangular shape, preventing air traps and resin oozing, which enhances the bonding process and ensures a consistent shape of the semiconductor device.
Implementation Method 1
a dispenser configured to fill, in the cross groove, the resin paste in the syringe via the supply hole with a gas pressure or an air pressure
Implementation Method 2
exhaust grooves that extend from ends of the cross groove to an outside of the bottom surface on the bottom surface
Data Source
AI summary
A nozzle of a semiconductor manufacturing apparatus includes a cross groove provided on a bottom surface, a supply hole provided in the center of the cross groove, and exhaust grooves that extend from ends of the cross groove to the outside of the bottom surface on the bottom surface and are shallower than the cross groove. The semiconductor manufacturing apparatus includes the nozzle, a syringe connected to the nozzle, and a dispenser that fills, in the cross groove, resin paste in the syringe via the supply hole with a gas pressure or an air pressure.