Resin Package Gas Bubble Elimination via Partial Cavity Filling
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor devices with resin packages often result in gas bubbles remaining within the package due to incomplete resin flow, which can damage the semiconductor element and affect the package's flatness and functionality.
Innovation Solution
A method involving a cavity mold design where one metal plate is in contact with the bottom surface and a space is maintained above the other metal plate, allowing the molten resin to flow and harden without filling the entire cavity initially, facilitating gas bubble escape through a gas releasing hole and reducing bubble entrapment, while ensuring the other metal plate's exposure and flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cavity is completely filled with resin, then the resin package is fully formed, but gas bubbles remain trapped within the package
Solution Approach 1:
The resin injection is stopped before the cavity is completely filled, leaving a portion of the cavity unfilled. This partial filling approach allows gas bubbles to escape through the gas releasing hole before the resin solidifies, preventing bubble entrapment while still achieving sufficient package formation
Solution Approach 2:
A gas releasing hole is预先 (pre) formed in the cavity at a position where gas bubbles can naturally rise and escape during resin injection. This preliminary structural preparation enables effective gas venting before the resin completely fills the cavity
2Shape
If the cavity is completely filled with resin, then the package structure is complete, but resin flow becomes disturbed and bubbles are trapped
Solution Approach 1:
The resin injection is intentionally stopped before complete cavity filling to avoid the disturbed flow condition that occurs in the final stage of injection. This partial filling maintains sufficient package structure while preserving uniform resin flow characteristics
3Reliability
If resin is injected to cover the upper metal plate, then the metal plate is protected, but gas bubbles may remain in the resin
Solution Approach 1:
The resin injection is stopped at the optimal point where the upper metal plate is adequately covered but the cavity is not completely filled. This partial filling ensures metal plate protection while maintaining conditions favorable for gas bubble escape
Solution Approach 2:
The gas releasing hole is预先 (pre) positioned to facilitate bubble escape during the injection process, allowing bubbles to vent before the resin completely covers the metal plate and solidifies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes gas bubbles within the resin package, enhances the semiconductor device's reliability by preventing bubble-induced damage and maintaining the flatness of the resin-covered metal plate, thus improving the manufacturing process.
Implementation Method 1
injecting a molten resin into the cavity so as to cover an upper side of the other metal plate
Implementation Method 2
hardening the molten resin injected into the cavity
Implementation Method 3
the assembly interposed between the bottom surface and the upper surface of the cavity thermally expands
Data Source
AI summary
A method of manufacturing a semiconductor device that includes a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, in which each of the pair of metal plates is exposed at corresponding one of both surfaces of the resin package is disclosed. The method may include preparing an assembly in which the semiconductor element is connected to the pair of metal plates; setting the assembly in a cavity of a mold, wherein one metal plate is in contact with a bottom surface of the cavity and a space is provided above the other metal plate; forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled.