Resin Package Substrate Design for Burr-Free Image Sensor Sealing
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Solution Overview
Problem
In the manufacturing of solid-state image pickup devices, the resin injection port placement poses challenges, leading to burr formation, dimensional inaccuracies, and reduced surface smoothness, while relocating it to avoid interference with metal sheets and lead frames either results in resin adhesion or increased package size, which is undesirable in compact designs.
Innovation Solution
The integration of a substrate with first and second protruding sections and a branched section within the resin package allows for a resin injection port placement between these sections, preventing burr contact and maintaining compactness, while ensuring reliable airtight sealing and surface smoothness through strategic placement of the metal sheet's branched section outside the fixing area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the resin injection port is located on the bottom surface or upper surface of the recessed section, then the package can be manufactured, but burr formation occurs affecting dimensional accuracy and surface smoothness
Solution Approach 1:
The harmful element (resin injection port) is extracted from the problematic locations (bottom surface or upper surface of recessed section) and relocated to a safe location (side surface between protruding sections) where it does not interfere with critical surfaces, thereby eliminating burr formation on important surfaces while maintaining manufacturability
Solution Approach 2:
The resin injection port is relocated from the vertical dimension (bottom or upper surface) to the horizontal dimension (side surface), specifically positioned between the first and second protruding sections. This dimensional shift allows the injection port to be away from critical surfaces while maintaining package integrity
2Manufacturing precision
If the resin injection port is provided above or below the metal sheet or lead frames on side surfaces, then burr formation is avoided, but resin adheres to metal sheet decreasing mounting accuracy or to lead frames decreasing solderability
Solution Approach 1:
The side surface of the package is divided into different functional zones: the first and second protruding sections provide structural support and positioning, while the space between them serves as a safe zone for the resin injection port. This local differentiation ensures that resin does not contact critical areas (metal sheet or lead frames) while maintaining their functional properties
3Reliability
If the package is increased in thickness or expanded in area to provide space for resin injection port on side surface, then resin adhesion to metal sheet and lead frames is avoided, but package compactness is reduced
Solution Approach 1:
The first and second protruding sections serve multiple functions: they provide structural support for the package, create positioning features for assembly, and simultaneously define a safe zone between them for the resin injection port. This multi-functionality allows the injection port to be positioned safely without increasing package dimensions
Data Source
AI summary
A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.